4
3.3.20
IPDS Version
.........................................................................................................................
23
3.4
COLOR MENU – Options Descriptions
...................................................................................
24
3.4.1
Color Management
................................................................................................................
24
3.4.2
User CMYK Profile
................................................................................................................
24
3.4.3
User RGB Profile
...................................................................................................................
24
3.4.4
User Dest. Profile
..................................................................................................................
25
3.4.5
RGB Grey to K
.......................................................................................................................
25
3.4.6
Preserve Black
.......................................................................................................................
25
3.4.7
Black Point Comp
..................................................................................................................
25
3.4.8
Embedded ICC Prof
...............................................................................................................
25
3.4.9
HL Mapping Table
.................................................................................................................
26
3.4.10
OCA Mapping Table
..............................................................................................................
26
3.4.11
DEF REND INTENT
..............................................................................................................
27
3.4.12
CMOCA Options
....................................................................................................................
27
3.4.13
Remove User Files
.................................................................................................................
28
3.5
PAPER HANDLING Menu – Option Descriptions
..................................................................
29
3.5.1
Offset Stacking
.......................................................................................................................
29
3.5.2
UNIVERSAL SIZE
..................................................................................................................
29
3.5.3
OTHER ENV SIZE
.................................................................................................................
31
3.6
MAP INPUT TRAYS Menu Options
.......................................................................................
33
3.7
MAP OUTPUT BINS Menu Options
.......................................................................................
36
3.7.1
Descriptions of Output Bin Values
.........................................................................................
36
3.7.2
Descriptions of IPDS Bin Selection Numbers
........................................................................
37
3.7.3
Default Bin Mapping
..............................................................................................................
37
3.8
MARGINS Menu Options
........................................................................................................
38
3.8.1
ALL INPUT TRAYS
................................................................................................................
40
3.8.2
TRAY 1 ADJUST
....................................................................................................................
40
3.8.3
TRAY 2 ADJUST
....................................................................................................................
40
3.8.4
TRAY 3 ADJUST
....................................................................................................................
41
3.8.5
TRAY 4 ADJUST
....................................................................................................................
41
3.8.6
TRAY 5 ADJUST
....................................................................................................................
42
3.8.7
MP FEEDER ADJUST
...........................................................................................................
42
3.8.8
MANUAL PAPER ADJ
..........................................................................................................
43
3.8.9
MANUAL ENV ADJ
...............................................................................................................
43
3.9
RESOURCE CAPTURE Menu Options
...................................................................................
44
3.9.1
Capture Media
.......................................................................................................................
44
3.9.2
Capture Fonts
........................................................................................................................
45
3.9.3
Capture Data Objects
............................................................................................................
45
3.9.4
Capture CMR Objects
............................................................................................................
45
3.9.5
Remove Resources
..................................................................................................................
45
4
Duplex Printing Using Preprinted Media
.............................................................................
47
5
Finishing Support
....................................................................................................................
48
5.1
Offset Stacking
..........................................................................................................................
50
5.1.1
AS/400 and iSeries Offset Stacking
........................................................................................
50
5.1.2
Mainframe Offset Stacking
.....................................................................................................
51
5.2
Stapling
.....................................................................................................................................
53
5.2.1
AS/400 and iSeries Stapling
...................................................................................................
53
5.3
Mainframe Stapling
...................................................................................................................
60
5.4
Hole Punch
................................................................................................................................
63
5.4.1
Hole Punch From an Input Source
........................................................................................
63