Sony PRS-505/SC Service Manual - Page 15

IC107, Audio play mode, IC953, USB connection state, IC1001, XTAL32K, IC801 - model number

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THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) For Printed Wiring Boards. Note: • Y : Parts extracted from the conductor side. • f : internal component. • : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) Caution: Parts face side: (Conductor side) Pattern face side: (Component side) Parts on the parts face side seen from the pattern face are indicated. Parts on the pattern face side seen from the parts face are indicated. • MAIN board is multi-layer printed board. However, the patterns of intermediate-layers have not been included in diagrams. * Replacing of IC1001 on the MAIN board used in this set requires a special tool. • Lead layouts surface Lead layout of conventional IC CSP (Chip Size Package) For Schematic Diagrams. Note: • All capacitors are in μF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. • f : internal component. • C : panel designation. Note: The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Note: Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié. • A : B+ Line. • B : B- Line. • C : adjustment for repair. • Power voltage is dc 5.2V and fed with regulated dc power supply from TP402 and TP400 on the MAIN board. • Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : POWER ON ( ) : AUDIO PLAY * : Impossible to measure (For this model, the voltage is produced only when the screen is changed. Under the power on, there is a voltage that is not produced.) • Voltages are taken with VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances. • Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. • Circled numbers refer to waveforms. • Signal path. F : AUDIO L : VIDEO N : USB O : SD MEMORY CARD/MEMORY STICK DUO * Replacing of IC1001 on the MAIN board used in this set requires a special tool. • The voltage and waveform of CSP (chip size package) cannot be measured, because its lead is different feom that conventional IC. • Waveforms - MAIN Board -  IC107  (Audio play mode) 3.6 Vp-p 89 ns 2 V/DIV, 50 ns/DIV  IC953 CL (XO) (USB connection state) 55.2 ms 2.2 Vp-p 1 V/DIV, 20 ms/DIV  IC1001 K[C (XTAL32K) 30.6 Ms 0.6 Vp-p 200 mV/DIV, 10 Ms/DIV  IC801  (X2) 30.8 Ms 2.2 Vp-p 1 V/DIV, 20 Ms/DIV  IC801  (OSC2) 204 ns 3.1 Vp-p 1 V/DIV, 100 ns/DIV PRS-505 15 15 PRS-505

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PRS-505
PRS-505
15
15
For Schematic Diagrams.
Note:
• All capacitors are in
μ
F unless otherwise noted.
(p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
speci
ed.
f
: internal component.
C
: panel designation.
THIS
NOTE
IS
COMMON
FOR
PRINTED
WIRING
BOARDS
AND
SCHEMATIC
DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
A
: B+ Line.
B
: B– Line.
C
: adjustment for repair.
Power voltage is dc 5.2V and fed with regulated dc power
supply from TP402 and TP400 on the MAIN board.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark
: POWER ON
(
) : AUDIO PLAY
*
: Impossible to measure
(For this model, the voltage is produced only when the
screen is changed. Under the power on, there is a voltage
that is not produced.)
• Voltages are taken with VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
L
: VIDEO
N
: USB
O
: SD MEMORY CARD/MEMORY STICK DUO
For Printed Wiring Boards.
Note:
Y
: Parts extracted from the conductor side.
f
: internal component.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Parts face side:
(Conductor side)
Pattern face side:
(Component side)
Parts on the parts face side seen from
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
Note:
The components identi-
ed by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number speci
ed.
Note:
Les composants identi
és
par une marque
0
sont
critiques pour la sécurité.
Ne les remplacer que par
une piéce portant le nu-
méro spéci
é.
• Waveforms
– MAIN Board –
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layers have not been in-
cluded
in diagrams.
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
*
Replacing of IC1001 on the MAIN board used in this
set requires a special tool.
IC107
(Audio play mode)
2 V/DIV, 50 ns/DIV
89 ns
3.6 Vp-p
IC953
(XO)
(USB connection state)
1 V/DIV, 20 ms/DIV
55.2 ms
2.2 Vp-p
IC1001
(XTAL32K)
200 mV/DIV, 10 s/DIV
30.6
s
0.6 Vp-p
IC801
(X2)
1 V/DIV, 20 s/DIV
30.8
s
2.2 Vp-p
IC801
(OSC2)
1 V/DIV, 100 ns/DIV
204 ns
3.1 Vp-p
C
K
The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead is different feom that conventional
IC.
*
Replacing of IC1001 on the MAIN board used in this
set requires a special tool.