HP ENVY 13-ag0000 Maintenance and Service Guide - Page 51

Thermal paste is used on the system board component, and associated heat sink

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5. Remove the thermal module (5). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the thermal module is removed. Replacement thermal material is included with the thermal module and system board spare part kits. Thermal paste is used on the system board component (1) and associated heat sink section (2). Component replacement procedures 43

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5.
Remove the thermal module
(5)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the thermal module is removed. Replacement thermal material is included with
the thermal module and system board spare part kits.
Thermal paste is used on the system board component
(1)
and associated heat sink section
(2)
.
Component replacement procedures
43