HP ENVY 14t-u000 HP ENVY 14 Notebook PC Maintenance and Service Guide - Page 65

Remove the thermal material. The thermal material must be thoroughly cleaned

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3. Disconnect all external devices from the computer. 4. Remove the battery (see Battery on page 29), and then remove the following components: a. Optical drive (see Optical drive on page 29) b. Top cover (see Top cover on page 37) c. Power connector cable (see Power connector cable on page 58) d. System board (see System board on page 48) e. Fan (see Fan on page 53) Remove the heat sink assembly: 1. Turn the system board upside down, with the front toward you. NOTE: Steps 2 through 4 apply to computer models equipped with switchable discrete graphics. See steps 5 through 7 for heat sink assembly removal information for computer models equipped with UMA graphics. 2. Remove the four Phillips M2.5x4.0 screws (1) and the three Phillips PM2.5x4.0 screws (2) that secure the heat sink assembly to the system board. 3. Remove the heat sink assembly (3) from the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and the system board components, it may be necessary to move the heat sink assembly from side to side to detach it. 4. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board components each time the heat sink assembly is removed. Replacement thermal material is included with the heat sink assembly and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink assembly section (4) that services it Component replacement procedures 55

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3.
Disconnect all external devices from the computer.
4.
Remove the battery (see
Battery
on page
29
), and then remove the following components:
a.
Optical drive (see
Optical drive
on page
29
)
b.
Top cover (see
Top cover
on page
37
)
c.
Power connector cable (see
Power connector cable
on page
58
)
d.
System board (see
System board
on page
48
)
e.
Fan (see
Fan
on page
53
)
Remove the heat sink assembly:
1.
Turn the system board upside down, with the front toward you.
NOTE:
Steps 2 through 4 apply to computer models equipped with switchable discrete
graphics. See steps 5 through 7 for heat sink assembly removal information for computer
models equipped with UMA graphics.
2.
Remove the four Phillips M2.5x4.0 screws
(1)
and the three Phillips PM2.5x4.0 screws
(2)
that
secure the heat sink assembly to the system board.
3.
Remove the heat sink assembly
(3)
from the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
assembly and the system board components, it may be necessary to move the heat sink
assembly from side to side to detach it.
4.
Remove the thermal material. The thermal material must be thoroughly cleaned from
the surfaces of the heat sink assembly and the system board components each time the heat
sink assembly is removed. Replacement thermal material is included with the heat sink
assembly and system board spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink assembly section
(2)
that
services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink assembly
section
(4)
that services it
Component replacement procedures
55