HP ENVY 17-s000 Maintenance and Service Guide - Page 52

and the heat sink component, Thermal paste is used on the processor

Get HP ENVY 17-s000 PDF manuals and user guides View all HP ENVY 17-s000 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 52 highlights

HP Confidential 2. Remove the heat sink (2). 3. For computer models equipped with a graphics subsystem with UMA memory, in the order indicated on the screws, remove the four Phillips PM2.0×3.0 screws (1) that secure the heat sink to the system board. 4. Remove the heat sink (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink component (2) that services it. Thermal paste is also used on the graphics subsystem chip (3) and the heat sink component (4) that services it. 44 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
2.
Remove the heat sink
(2)
.
3.
For computer models equipped with a graphics subsystem with UMA memory, in the order indicated on
the screws, remove the four Phillips PM2.0×3.0 screws
(1)
that secure the heat sink to the system board.
4.
Remove the heat sink
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed.
Thermal paste is used on the processor
(1)
and the heat sink component
(2)
that services it. Thermal paste is
also used on the graphics subsystem chip
(3)
and the heat sink component
(4)
that services it.
HP
Confidential
44
Chapter 6
Removal and replacement procedures for Authorized Service Provider parts