HP G62-400 HP G62 Notebook PC - Maintenance and Service Guide - Page 90

and the processor component

Get HP G62-400 - Notebook PC PDF manuals and user guides View all HP G62-400 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 90 highlights

NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board, and processor spare part kits. The following illustration shows the locations for thermal material on systems with UMA graphics subsystems. The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1) and (3), and the processor component (2), each time the fan/heat sink assembly is removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is reinstalled. The following illustration shows the locations for thermal material on systems with discrete graphics subsystems. 80 Chapter 4 Removal and replacement procedures

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
NOTE:
Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with UMA graphics
subsystems.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly
(1)
and
(3)
, and the processor component
(2)
, each time the fan/heat sink assembly is removed. Thermal
pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is
reinstalled.
The following illustration shows the locations for thermal material on systems with discrete graphics
subsystems.
80
Chapter 4
Removal and replacement procedures