HP Pavilion 14-ab000 ab000 through 14 - ab099 Maintenance and Service Guide 1 - Page 61

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2. Lift heat sink away from system board (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink and system board spare part kits. Thermal material is used in the following locations: ● Thermal material is used on the processor (1) and the heat sink section (2) that services it. ● A thermal pad is also used on the graphics subsystem component (3) and the heat sink section (4) that services it. Component replacement procedures 51

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2.
Lift heat sink away from system board
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and the
system board components, it may be necessary to move the heat sink from side to side to detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink and system board spare part kits. Thermal material is used in the following locations:
●
Thermal material is used on the processor
(1)
and the heat sink section
(2)
that services it.
●
A thermal pad is also used on the graphics subsystem component
(3)
and the heat sink section
(4)
that
services it.
Component replacement procedures
51