HP Pavilion 14-n100 Maintenance and Service Guide - Page 102

spare part kits., Thermal paste is used on the processor

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Remove the heat sink assembly: 1. Turn the system board upside down, with the front toward you. NOTE: Steps 2 through 4 apply to computer models equipped with switchable discrete graphics. See steps 5 through 7 for heat sink assembly removal information for computer models equipped with UMA graphics. 2. Following the 1, 2, 3, 4, 5, 6, 7 sequence stamped into the heat sink assembly, loosen the 4 Phillips PM2.0×10.0 captive screws (1) and the 3 Phillips PM2.0×3.5 captive screws (2) that secure the heat sink assembly to the system board. 3. Remove the heat sink assembly (3) from the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and the system board components, it may be necessary to move the heat sink assembly from side to side to detach it. 4. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board components each time the heat sink assembly is removed. Replacement thermal material is included with the heat sink assembly and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink assembly section (4) that services it 92 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts

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Remove the heat sink assembly:
1.
Turn the system board upside down, with the front toward you.
NOTE:
Steps 2 through 4 apply to computer models equipped with switchable discrete
graphics. See steps 5 through 7 for heat sink assembly removal information for computer models
equipped with UMA graphics.
2.
Following the 1, 2, 3, 4, 5, 6, 7 sequence stamped into the heat sink assembly, loosen the 4
Phillips PM2.0×10.0 captive screws
(1)
and the 3 Phillips PM2.0×3.5 captive screws
(2)
that
secure the heat sink assembly to the system board.
3.
Remove the heat sink assembly
(3)
from the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
assembly and the system board components, it may be necessary to move the heat sink assembly
from side to side to detach it.
4.
Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of
the heat sink assembly and the system board components each time the heat sink assembly is
removed. Replacement thermal material is included with the heat sink assembly and system board
spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink assembly section
(2)
that
services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink assembly
section
(4)
that services it
92
Chapter 6
Removal and replacement procedures for Authorized Service Provider parts