HP Pavilion 14-n100 Maintenance and Service Guide - Page 103

removed. Replacement thermal material is included with the heat sink assembly and system board

Page 103 highlights

Reverse this procedure to install the heat sink assembly on computer models equipped with switchable discrete graphics. 5. Following the 1, 2, 3, 4 sequence stamped into the heat sink assembly, loosen the 4 Phillips PM2.0×10.0 captive screws (1) that secure the heat sink assembly to the system board. 6. Remove the heat sink assembly (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it may be necessary to move the heat sink assembly from side to side to detach it. 7. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board components each time the heat sink assembly is removed. Replacement thermal material is included with the heat sink assembly and system board spare part kits. Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it. Component replacement procedures 93

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Reverse this procedure to install the heat sink assembly on computer models equipped with
switchable discrete graphics.
5.
Following the 1, 2, 3, 4 sequence stamped into the heat sink assembly, loosen the 4 Phillips
PM2.0×10.0 captive screws
(1)
that secure the heat sink assembly to the system board.
6.
Remove the heat sink assembly
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it may be necessary to move the heat sink assembly from
side to side to detach it.
7.
Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of
the heat sink assembly and the system board components each time the heat sink assembly is
removed. Replacement thermal material is included with the heat sink assembly and system board
spare part kits. Thermal paste is used on the processor
(1)
and the heat sink assembly section
(2)
that services it.
Component replacement procedures
93