HP Pavilion dm1-2000 HP Pavilion dm1 Notebook PC - Maintenance and Service Gui - Page 78

Thermal pads are used on the graphics chip, that services it.

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2. Remove the heat sink assembly (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board each time the fan and heat sink are removed: Thermal paste is used on the Southbridge (2), and the heat sink section (1) that services it. Thermal pads are used on the graphics chip (4) and the heat sink section (3) that services it. Thermal pads are used on the processor (6) and the heat sink section (5) that services it. Replacement thermal material is included with all heat sink assembly and system board spare part kits. Reverse this procedure to install the heat sink assembly. 70 Chapter 4 Removal and replacement procedures

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2.
Remove the heat sink assembly
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
assembly and the system board each time the fan and heat sink are removed:
Thermal paste is used on the Southbridge
(2)
, and the heat sink section
(1)
that services it.
Thermal pads are used on the graphics chip
(4)
and the heat sink section
(3)
that services it.
Thermal pads are used on the processor
(6)
and the heat sink section
(5)
that services it.
Replacement thermal material is included with all heat sink assembly and system board spare part
kits.
Reverse this procedure to install the heat sink assembly.
70
Chapter 4
Removal and replacement procedures