Intel Q9300 Data Sheet - Page 76
Table 5-1., Processor Thermal Specifications - power consumption
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Thermal Specifications and Design Considerations The case temperature is defined at the geometric top center of the processor. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained time periods. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor feature is designed to protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained periods of time. For more details on the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor or Thermal Monitor 2 feature must be enabled for the processor to remain within specification. Table 5-1. Processor Thermal Specifications Processor Number Core Freq. (GHz) Thermal Design Power (W) 3, 4 Extended HALT Power (W)1 Deeper Sleep Power (W)2 QX9770 3.20 136 16 - QX9650 3.00 130 16 - Q9650 3.0 95 12 8 Q9550 2.83 95 12 8 Q9550 2.83 95 12 - Q9505 2.83 95 12 - Q9450 2.66 95 12 - Q9400 2.66 95 12 8 Q9300 2.50 95 12 - Q8400 2.66 95 12 8 Q8300 2.50 95 12 8 Q8200 2.33 95 12 - Q9550S 2.83 65 12 8 Q9505S 2.83 65 12 8 Q9400S 2.66 65 12 8 Q8400S 2.66 65 12 8 Q8200S 2.33 65 12 8 775_VR_CO NFIG5 Minimum TC (°C) Maximum TC (°C) Notes See Table 5-2 - 5 and 8 Figure 5-1 775_VR_CO NFIG_05B See Table 5-3 5 and 7, 8 Figure 5-2 775_VR_CO NFIG_05A 5 6 5 6 5 7 5 7 5 See Table 5-4 7 and 5 Figure 5-3 6 5 7 5 6 5 6 5 7 775_VR_CO NFIG_06 5 6 5 See Table 5-5 6 5 and 6 5 Figure 5-4 6 5 6 NOTES: 1. Specification is at 37° C Tc and minimum voltage loadline. Specification is ensured by design characterization and not 100% tested. 2. Specification is at 34° C Tc and minimum voltage loadline. Specification is ensured by design characterization and not 100% tested. 3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate. 4. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed combinations of power and TC. 5. 775_VR_CONFIG_05 guidelines provide a design target for meeting future thermal requirements. 6. These processors have CPUID = 1067Ah. 7. These processors have CPUID = 10677h. 8. These processors have CPUID = 10676h. 76 Datasheet