Intel Q9300 Data Sheet - Page 81

Datasheet

81

Thermal Specifications and Design Considerations

5.1.2

Thermal Metrology

The maximum and minimum case temperatures (T

C

) for the processor is specified in

Table 5-1

. This temperature specification is meant to help ensure proper operation of

the processor.

Figure 5-5

illustrates where Intel recommends T

C

thermal

measurements should be made. For detailed guidelines on temperature measurement

methodology, refer to the appropriate Thermal and Mechanical Design Guidelines (See

Section 1.2

).

5.2

Processor Thermal Features

5.2.1

Thermal Monitor

The Thermal Monitor feature helps control the processor temperature by activating the

thermal control circuit (TCC) when the processor silicon reaches its maximum operating

temperature. The TCC reduces processor power consumption by modulating (starting

and stopping) the internal processor core clocks.

The Thermal Monitor feature must

be enabled for the processor to be operating within specifications.

The

temperature at which Thermal Monitor activates the thermal control circuit is not user

configurable and is not software visible. Bus traffic is snooped in the normal manner,

and interrupt requests are latched (and serviced during the time that the clocks are on)

while the TCC is active.

When the Thermal Monitor feature is enabled, and a high temperature situation exists

(i.e., TCC is active), the clocks will be modulated by alternately turning the clocks off

and on at a duty cycle specific to the processor (typically 30-50%). Clocks often will not

be off for more than 3.0 microseconds when the TCC is active. Cycle times are

processor speed dependent and will decrease as processor core frequencies increase. A

small amount of hysteresis has been included to prevent rapid active/inactive

transitions of the TCC when the processor temperature is near its maximum operating

temperature. Once the temperature has dropped below the maximum operating

temperature, and the hysteresis timer has expired, the TCC goes inactive and clock

modulation ceases.

With a properly designed and characterized thermal solution, it is anticipated that the

TCC would only be activated for very short periods of time when running the most

power intensive applications. The processor performance impact due to these brief

Figure 5-5.

Case Temperature (T

C

) Measurement Location

37.5 mm

Measure T

C

at this point

(geometric center of the package)

37.5 mm

37.5 mm

Measure T

C

at this point

(geometric center of the package)

37.5 mm

Section	Page
Intel® Core™2 Extreme Processor QX9000D Series, Intel® Core™2 Quad Processor Q9000D, Q9000SD, Q8000D, and Q8000SD Series	1
Contents	3
Figures	5
Tables	6
Revision History	7
Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, Q8000S Series Features	9
1 Introduction	11
1.1 Terminology	12
1.1.1 Processor Terminology Definitions	12
1.2 References	14
2 Electrical Specifications	15
2.1 Power and Ground Lands	15
2.2 Decoupling Guidelines	15
2.2.1 VCC Decoupling	15
2.2.2 Vtt Decoupling	15
2.2.3 FSB Decoupling	16
2.3 Voltage Identification	16
2.4 Reserved, Unused, and TESTHI Signals	18
2.5 Power Segment Identifier (PSID)	18
2.6 Voltage and Current Specification	19
2.6.1 Absolute Maximum and Minimum Ratings	19
2.6.2 DC Voltage and Current Specification	20
2.6.3 VCC Overshoot	25
2.6.4 Die Voltage Validation	25
2.7 Signaling Specifications	26
2.7.1 FSB Signal Groups	26
2.7.2 CMOS and Open Drain Signals	28
2.7.3 Processor DC Specifications	28
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications	29
2.7.3.2 GTL+ Front Side Bus Specifications	30
2.8 Clock Specifications	31
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])	32
2.8.3 Phase Lock Loop (PLL) and Filter	32
2.8.4 BCLK[1:0] Specifications	32
3 Package Mechanical Specifications	35
3.1 Package Mechanical Drawing	35
3.2 Processor Component Keep-Out Zones	39
3.3 Package Loading Specifications	39
3.4 Package Handling Guidelines	39
3.5 Package Insertion Specifications	40
3.6 Processor Mass Specification	40
3.7 Processor Materials	40
3.8 Processor Markings	40
4 Land Listing and Signal Descriptions	43
4.1 Processor Land Assignments	43
4.2 Alphabetical Signals Reference	64
5 Thermal Specifications and Design Considerations	75
5.1 Processor Thermal Specifications	75
5.1.1 Thermal Specifications	75
5.1.2 Thermal Metrology	81
5.2 Processor Thermal Features	81
5.2.1 Thermal Monitor	81
5.2.2 Thermal Monitor 2	82
5.2.3 On-Demand Mode	83
5.2.4 PROCHOT# Signal	84
5.2.5 THERMTRIP# Signal	84
5.3 Platform Environment Control Interface (PECI)	85
5.3.1 Introduction	85
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems	85
5.3.2 PECI Specifications	86
5.3.2.1 PECI Device Address	86
5.3.2.2 PECI Command Support	86
5.3.2.3 PECI Fault Handling Requirements	86
5.3.2.4 PECI GetTemp0() Error Code Support	86
6 Features	87
6.1 Power-On Configuration Options	87
6.2 Clock Control and Low Power States	87
6.2.1 Normal State	88
6.2.2 HALT and Extended HALT Powerdown States	88
6.2.2.1 HALT Powerdown State	88
6.2.2.2 Extended HALT Powerdown State	89
6.2.3 Stop Grant and Extended Stop Grant States	89
6.2.3.1 Stop-Grant State	89
6.2.3.2 Extended Stop Grant State	90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State	90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State	90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State	90
6.2.5 Sleep State	90
6.2.6 Deep Sleep State	91
6.2.7 Deeper Sleep State	91
6.2.8 Enhanced Intel SpeedStep® Technology	92
6.3 Processor Power Status Indicator (PSI) Signal	92
7 Boxed Processor Specifications	93
7.1 Introduction	93
7.2 Mechanical Specifications	94
7.2.1 Boxed Processor Cooling Solution Dimensions	94
7.2.2 Boxed Processor Fan Heatsink Weight	95
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	95
7.3 Electrical Requirements	95
7.3.1 Fan Heatsink Power Supply	95
7.4 Thermal Specifications	97
7.4.1 Boxed Processor Cooling Requirements	97
7.4.2 Variable Speed Fan	98
7.5 Boxed Intel® Core™2 Extreme Processor QX9650 Specifications	99
7.5.1 Boxed Intel® Core™2 Extreme Processor QX9650 Fan Heatsink Weight	100
8 Debug Tools Specifications	103
8.1 Logic Analyzer Interface (LAI)	103
8.1.1 Mechanical Considerations	103

Intel Q9300 Data Sheet - Page 81

Processor Thermal Features

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