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Intel Q9300 Data Sheet - Page 96

Boxed Processor Fan Heatsink Power Cable Connector Description

UPC - 675900938236

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Boxed Processor Specifications The power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it. The power header identification and location should be documented in the platform documentation, or on the system board itself. Figure 7-6 shows the location of the fan power connector relative to the processor socket. The baseboard power header should be positioned within 110 mm [4.33 inches] from the center of the processor socket. Figure 7-5. Boxed Processor Fan Heatsink Power Cable Connector Description Pin Signal 1 GND 2 +12 V 3 SENSE 4 CONTROL Straight square pin, 4-pin terminal housing with polarizing ribs and friction locking ramp. 0.100" pitch, 0.025" square pin width. Match with straight pin, friction lock header on mainboard. 1 2 34 Table 7-1. Fan Heatsink Power and Signal Specifications Description Min Typ +12 V: 12 volt fan power supply 11.4 12 IC: - Maximum fan steady-state current draw - 1.2 - Average fan steady-state current draw - 0.5 - Maximum fan start-up current draw - 2.2 - Fan start-up current draw maximum duration - 1.0 SENSE: SENSE frequency - 2 CONTROL 21 25 NOTES: 1. Baseboard should pull this pin up to 5 V with a resistor. 2. Open drain type, pulse width modulated. 3. Fan will have pull-up resistor for this signal to maximum of 5.25 V. Max 12.6 - - - - - 28 Unit V Notes - A A - A Second pulses per fan 1 revolution kHz 2, 3 Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket R110 [4.33] B C 98 Datasheet

Section	Page
Intel® Core™2 Extreme Processor QX9000D Series, Intel® Core™2 Quad Processor Q9000D, Q9000SD, Q8000D, and Q8000SD Series	1
Contents	3
Figures	5
Tables	6
Revision History	7
Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, Q8000S Series Features	9
1 Introduction	11
1.1 Terminology	12
1.1.1 Processor Terminology Definitions	12
1.2 References	14
2 Electrical Specifications	15
2.1 Power and Ground Lands	15
2.2 Decoupling Guidelines	15
2.2.1 VCC Decoupling	15
2.2.2 Vtt Decoupling	15
2.2.3 FSB Decoupling	16
2.3 Voltage Identification	16
2.4 Reserved, Unused, and TESTHI Signals	18
2.5 Power Segment Identifier (PSID)	18
2.6 Voltage and Current Specification	19
2.6.1 Absolute Maximum and Minimum Ratings	19
2.6.2 DC Voltage and Current Specification	20
2.6.3 VCC Overshoot	25
2.6.4 Die Voltage Validation	25
2.7 Signaling Specifications	26
2.7.1 FSB Signal Groups	26
2.7.2 CMOS and Open Drain Signals	28
2.7.3 Processor DC Specifications	28
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications	29
2.7.3.2 GTL+ Front Side Bus Specifications	30
2.8 Clock Specifications	31
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])	32
2.8.3 Phase Lock Loop (PLL) and Filter	32
2.8.4 BCLK[1:0] Specifications	32
3 Package Mechanical Specifications	35
3.1 Package Mechanical Drawing	35
3.2 Processor Component Keep-Out Zones	39
3.3 Package Loading Specifications	39
3.4 Package Handling Guidelines	39
3.5 Package Insertion Specifications	40
3.6 Processor Mass Specification	40
3.7 Processor Materials	40
3.8 Processor Markings	40
4 Land Listing and Signal Descriptions	43
4.1 Processor Land Assignments	43
4.2 Alphabetical Signals Reference	64
5 Thermal Specifications and Design Considerations	75
5.1 Processor Thermal Specifications	75
5.1.1 Thermal Specifications	75
5.1.2 Thermal Metrology	81
5.2 Processor Thermal Features	81
5.2.1 Thermal Monitor	81
5.2.2 Thermal Monitor 2	82
5.2.3 On-Demand Mode	83
5.2.4 PROCHOT# Signal	84
5.2.5 THERMTRIP# Signal	84
5.3 Platform Environment Control Interface (PECI)	85
5.3.1 Introduction	85
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems	85
5.3.2 PECI Specifications	86
5.3.2.1 PECI Device Address	86
5.3.2.2 PECI Command Support	86
5.3.2.3 PECI Fault Handling Requirements	86
5.3.2.4 PECI GetTemp0() Error Code Support	86
6 Features	87
6.1 Power-On Configuration Options	87
6.2 Clock Control and Low Power States	87
6.2.1 Normal State	88
6.2.2 HALT and Extended HALT Powerdown States	88
6.2.2.1 HALT Powerdown State	88
6.2.2.2 Extended HALT Powerdown State	89
6.2.3 Stop Grant and Extended Stop Grant States	89
6.2.3.1 Stop-Grant State	89
6.2.3.2 Extended Stop Grant State	90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State	90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State	90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State	90
6.2.5 Sleep State	90
6.2.6 Deep Sleep State	91
6.2.7 Deeper Sleep State	91
6.2.8 Enhanced Intel SpeedStep® Technology	92
6.3 Processor Power Status Indicator (PSI) Signal	92
7 Boxed Processor Specifications	93
7.1 Introduction	93
7.2 Mechanical Specifications	94
7.2.1 Boxed Processor Cooling Solution Dimensions	94
7.2.2 Boxed Processor Fan Heatsink Weight	95
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	95
7.3 Electrical Requirements	95
7.3.1 Fan Heatsink Power Supply	95
7.4 Thermal Specifications	97
7.4.1 Boxed Processor Cooling Requirements	97
7.4.2 Variable Speed Fan	98
7.5 Boxed Intel® Core™2 Extreme Processor QX9650 Specifications	99
7.5.1 Boxed Intel® Core™2 Extreme Processor QX9650 Fan Heatsink Weight	100
8 Debug Tools Specifications	103
8.1 Logic Analyzer Interface (LAI)	103
8.1.1 Mechanical Considerations	103