Intel WX58BP Product Guide - Page 71

Restriction of Hazardous Substances RoHS

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Regulatory Compliance Table 16. Lead-Free Second Level Interconnect Marks Description Mark This symbol is used to identify electrical and electronic assemblies and components in which the Pb concentration level in the Board substrate and the solder connections from the board to the components (second-level or interconnect) is not greater than 0.1% by weight (1000 ppm). or Restriction of Hazardous Substances (RoHS) EU RoHS EU RoHS Directive 2002/95/EC restricts the use of the following six materials in various types of electronic and electrical equipment:  Lead  Mercury  Cadmium  Hexavalent chromium  Polybrominated biphenyls (PBB)  Polybrominated diphenyl ether (PBDE) The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of homogeneous material. Intel® Workstation Board WX58BP complies with these restrictions. 71

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Regulatory Compliance
71
Table 16.
Lead-Free Second
Level Interconnect Marks
Description
Mark
This symbol is used to identify
electrical and electronic
assemblies and components in
which the Pb concentration
level in the Board substrate
and the solder connections
from the board to the
components (second-level
interconnect) is not greater
than 0.1% by weight
(1000 ppm).
or
or
Restriction of Hazardous Substances (RoHS)
EU RoHS
EU RoHS Directive 2002/95/EC restricts the use of the following six materials in
various types of electronic and electrical equipment:
Lead
Mercury
Cadmium
Hexavalent chromium
Polybrominated biphenyls (PBB)
Polybrominated diphenyl ether (PBDE)
The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium,
which is limited to 0.01% or 100 ppm) by weight of homogeneous material.
Intel
®
Workstation Board WX58BP complies with these restrictions.