Sony MHC-NX1 Service Manual - Page 45

TABLE OF CONTENTS 1. SERVICING NOTES 2 2. GENERAL Location of Controls 5 3. DISASSEMBLY 6 4. TEST MODE 13 5. MECHANICAL ADJUSTMENTS 14 6. ELECTRICAL ADJUSTMENTS TAPE DECK Section 14 CD Section 17 7. DIAGRAMS 7-1. Note for Printed Wiring Boards and Schematic Diagrams 19 7-2. Printed Wiring Board - BD Board 20 7-3. Schematic Diagram - BD Board 21 7-4. Printed Wiring Boards - CD MOTOR/SENSOR Section 22 7-5. Schematic Diagram - CD MOTOR/SENSOR Section 23 7-6. Printed Wiring Board - AUDIO Board 24 7-7. Schematic Diagram - AUDIO Board 25 7-8. Printed Wiring Board - LEAF SW Board 26 7-9. Schematic Diagram - LEAF SW Board 26 7-10. Printed Wiring Board - MAIN Board 27 7-11. Schematic Diagram - MAIN Board (1/2 28 7-12. Schematic Diagram - MAIN Board (2/2 29 7-13. Printed Wiring Boards - PANEL Section 30 7-14. Schematic Diagram - PANEL Section 31 7-15. IC Pin Function Description 34 8. EXPLODED VIEWS 37 9. ELECTRICAL PARTS LIST 44 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. 2 SECTION 1 SERVICING NOTES This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. The following caution label is located inside the unit. CAUTION : INVISIBLE LASER RADIATION WHEN OPEN AND INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM. ADVARSEL : USYNLIG LASERSTRÅLING VED ÅBNING NÅR SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGÅ UDSAETTELSE FOR STRÅLING. VORSICHT : UNSICHTBARE LASERSTRAHLUNG, WENN ABDECKUNG GEÖFFNET UND SICHEREITSVERRIEGELUNG ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN. VARO! : AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT- TIINA NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN. VARNING : OSYNLING LASERSTRÅLING NÄR DENNA DEL ÄR ÖPPNAD OCH SPÄRREN ÄR URKOPPLAD. BETRAKTA EJ STRÅLEN. ADVERSEL : USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES OG SIKKERHEDSLÅS BRYTES. UNNGÅ EKSPONERING FOR STRÅLEN. VIGYAZAT! : A BURKOLAT NYITÁSAKOR LÁTHATATLAN LÉZERSU- GÁRVESZÉLY! KERÜLJE A BESUGÁRZÁST! NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Notes on chip component replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.