Sony MZ-R50 Service Manual - Page 2

Servicing Note, General, Disassembly, Test Mode, Adjustments, Diagrams, Exploded Views, Electrical - manual

Page 2 highlights

Battery operation time See "Battery life" Battery life Batteries LIP-8 lithium ion Rechargeable battery Two LR6 (size AA) Sony alkaline dry batteries Recording Approx. 4 hours LIP-8 + Two LR6 (size AA) Dimensions Approx. 109.5 x 19.7 x 77 mm (w/h/d) (4 3/8 x 25/32 x 3 1/8 in.) Mass Approx. 190 g (6.8 oz) the recorder only Approx. 240 g (8.5 oz) incl, a recordable MD, and LIP-8 lithium ion rechargeable battery Supplied accessories AC power adaptor (1) Headphones with a remote control (1) LIP-8 lithium ion rechargeable battery (1) Dry battery case (1) Ear pads (2) Carrying case (1) Playback Approx. 7 hours Approx. 12 hours Approx. 22 hours Design and specifications are subject to change without notice. For customers in Europe This MiniDisc Recorder is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the buttom exterior. TABLE OF CONTENTS Specifications 1 1. SERVICING NOTE 3 2. GENERAL Location and Function of Controls 4 3. DISASSEMBLY 3-1. Upper Panel Assy, Bottom Panel Assy Removal ...... 20 3-2. Main Board Removal 21 3-3. Mechanism Deck (MT-MZR50-143) Removal ........ 21 3-4. Optical Pick-up Assy, REC Board Removal 22 3-5. CLV Board Removal 22 3-6. Battery Case Assy Removal 23 3-7. Power Board, Switch Board Removal 23 3-8. Switch Unit (with JOG Dial) Removal 24 4. TEST MODE 25 5. ADJUSTMENTS 31 6. DIAGRAMS 6-1. Explanation of IC Terminals 35 6-2. Block Diagrams 39 6-3. Circuit Boards Location 43 6-4. Printed Wiring Boards - Main Section 45 6-5. Schematic Diagram - Main (1/3) Section 49 6-6. Schematic Diagram - Main (2/3) Section 53 6-7. Schematic Diagram - Main (3/3) Section 57 7. EXPLODED VIEWS 7-1. Upper Panel, Bottom Panel Section 65 7-2. Chassis Section 66 7-3. Mechanism Deck Section 67 8. ELECTRICAL PARTS LIST 68 Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270°C during repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. - 2 -

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56

– 2 –
Specifications
...........................................................................
1
1.
SERVICING NOTE
.......................................................
3
2.
GENERAL
Location and Function of Controls
....................................
4
3.
DISASSEMBLY
3-1. Upper Panel Assy, Bottom Panel Assy Removal
......
20
3-2. Main Board Removal
...............................................
21
3-3. Mechanism Deck (MT-MZR50-143) Removal
........
21
3-4. Optical Pick-up Assy, REC Board Removal
............
22
3-5. CLV Board Removal
................................................
22
3-6. Battery Case Assy Removal
.....................................
23
3-7. Power Board, Switch Board Removal
......................
23
3-8. Switch Unit (with JOG Dial) Removal
....................
24
4.
TEST MODE
.................................................................
25
5.
ADJUSTMENTS
.........................................................
31
6.
DIAGRAMS
6-1. Explanation of IC Terminals
.....................................
35
6-2. Block Diagrams
........................................................
39
6-3. Circuit Boards Location
...........................................
43
6-4. Printed Wiring Boards – Main Section –
..................
45
6-5. Schematic Diagram – Main (1/3) Section –
.............
49
6-6. Schematic Diagram – Main (2/3) Section –
.............
53
6-7. Schematic Diagram – Main (3/3) Section –
.............
57
7.
EXPLODED VIEWS
7-1. Upper Panel, Bottom Panel Section
.........................
65
7-2. Chassis Section
.........................................................
66
7-3. Mechanism Deck Section
.........................................
67
8.
ELECTRICAL PARTS LIST
....................................
68
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
!
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE WITH
MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270°C
during repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
TABLE OF CONTENTS
This MiniDisc Recorder is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT label is
located on the buttom exterior.
For customers in Europe
Battery operation time
See “Battery life”
Battery life
Batteries
Recording
Playback
LIP-8 lithium ion
Approx.
Approx.
Rechargeable battery
4 hours
7 hours
Two LR6 (size AA)
Approx.
Sony alkaline dry batteries
12 hours
LIP-8 + Two LR6 (size AA)
Approx.
22 hours
Dimensions
Approx. 109.5 x 19.7 x 77 mm (w/h/d)
(4
3
/
8
x
25
/
32
x 3
1
/
8
in.)
Mass
Approx. 190 g (6.8 oz) the recorder only
Approx. 240 g (8.5 oz) incl, a recordable MD,
and LIP-8 lithium ion rechargeable battery
Supplied accessories
AC power adaptor (1)
Headphones with a remote control (1)
LIP-8 lithium ion rechargeable battery (1)
Dry battery case (1)
Ear pads (2)
Carrying case (1)
Design and specifications are subject to change without notice.