Compaq 8000 Technical Reference Guide: HP Compaq 8000 Elite Series Business De - Page 31

Processor/Memory Subsystem 3.2.2 Processor Changing/Upgrading All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the processor use an integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan assembly as the original to ensure proper cooling. The heatsink and attachment clip are specially designed provide maximum heat transfer from the processor component. CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such a condition could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions. Table 3-1 provides a sample listing of processors supported by these systems. Intel Series Q9nnn Q6nnn E8nnn E6nnn E4nnn Core design quad quad dual dual dual Table 3-1 Supported Processors (partial listing) Features Highest Clock Speed in GHz Highest FSB Speed in MHz L2 Cache VT, [1] 3.00 1333 2 x 6 MB VT, [1] 2.66 1066 2 x 4 MB vPro, VT, TXT, [1] 3.33 1333 6 MB vPro, VT, TXT, [1] 3.00 1333 4 MB [1] 2.60 800 2 MB Form Factor support SFF, CMT SFF, CMT all all NOTE: [1] Standard Intel feature set including EM64T, XD, and EIST support. Refer to www.intel.com for detailed information. CAUTION: The USDT form factor can support a processor with a maximum power consumption of 65 watts. The SFF and CMT form factors can support a processor with a maximum power consumption of 95 watts. Exceeding these limits can result in system damage and lost data. Technical Reference Guide www.hp.com 3-3