Compaq 8000 Technical Reference Guide: HP Compaq 8000 Elite Series Business De - Page 75

Power and Signal Distribution, 7.1 Introduction, 7.2 USDT Power Distribution

Page 75 highlights

7 Power and Signal Distribution 7.1 Introduction This chapter describes the power supplies and discusses the methods of general power and signal distribution. Topics covered in this chapter include: ■ USDT power distribution (7.2) ■ SFF/CMT power distribution (7.3) ■ Power Control (7.4) ■ Signal distribution (7.5) 7.2 USDT Power Distribution Each form factor uses a unique power supply assembly and implements different methods of power generation and distribution. The USDT form factor uses an external ("brick") supply while the SFF and CMT form factors use a power supply unit contained within the system chassis. The subassemblies are not interchangeable between the three form factors. The USDT form factor uses an external ("brick") supply that connects to the chassis through a three-conductor cable (Figure 7-1). All voltages required by the processing circuits, peripherals, and storage devices are produced on the system board from the 19.5 VDC produced by the external power supply assembly. The external power supply always produces 19.5 VDC as long as it is connected to an active AC outlet. USDT Chassis Front Bezel System Board Power Button Power On Power Control Logic, Voltage Regulators +19.5 Rtn VDC Pwr rating & ID 90 - 264 VAC External Power Supply Unit Figure 7-1. USDT Power Generation, Block Diagram Technical Reference Guide www.hp.com 7-1

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114

Technical Reference Guide
www.hp.com
7-1
7
Power and Signal Distribution
7.1
Introduction
This chapter describes the power supplies and discusses the methods of general power and signal
distribution. Topics covered in this chapter include:
USDT power distribution (7.2)
SFF/CMT power distribution (7.3)
Power Control (7.4)
Signal distribution (7.5)
7.2 USDT Power Distribution
Each form factor uses a unique power supply assembly and implements different methods of
power generation and distribution. The USDT form factor uses an external (“brick”) supply
while the SFF and CMT form factors use a power supply unit contained within the system
chassis. The subassemblies are not interchangeable between the three form factors.
The USDT form factor uses an external (“brick”) supply that connects to the chassis through a
three-conductor cable (Figure 7-1). All voltages required by the processing circuits, peripherals,
and storage devices are produced on the system board from the 19.5 VDC produced by the
external power supply assembly. The external power supply always produces 19.5 VDC as long
as it is connected to an active AC outlet.
Figure 7-1. USDT Power Generation, Block Diagram
System Board
Power Supply
Power On
Power Control Logic,
Front Bezel
Voltage Regulators
Unit
Power Button
+19.5
USDT Chassis
90 - 264 VAC
Rtn
Pwr rating
& ID
VDC
External