HP 600 HP StorageWorks 600 Modular Disk System Maintenance and Service Guide - Page 33
I/O module blank
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3. Release the I/O handle, push the I/O handle down until it ejects the I/O module, and then remove the I/O module. CAUTION: For best cooling practices, do not operate the enclosure for extended periods with more than one component or blank removed. When removing an active component permanently, replace it with a blank. To replace the component, reverse the removal procedure. Be sure the I/O module is fully seated and the I/O module handle is in the locked position. I/O module blank CAUTION: For best cooling practices, do not operate the enclosure for extended periods with more than one component or blank removed. When removing an active component permanently, replace it with a blank. Removal and replacement procedures 33
Removal and replacement procedures
33
3.
Release the I/O handle, push the I/O handle down until it ejects the I/O module, and then remove the
I/O module.
CAUTION:
For best cooling practices, do not operate the enclosure for extended periods with
more than one component or blank removed. When removing an active component permanently,
replace it with a blank.
To replace the component, reverse the removal procedure. Be sure the I/O module is fully seated and the I/O
module handle is in the locked position.
I/O module blank
CAUTION:
For best cooling practices, do not operate the enclosure for extended periods with
more than one component or blank removed. When removing an active component permanently,
replace it with a blank.