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HP BL260c HP BladeSystem c-Class Site Planning Guide - Page 2

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UPC - 883585668663

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© Copyright 2007, 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Intended audience This document is for the person who plans for and installs HP BladeSystem c-Class products. Only persons experienced in server blade technology and configuration should attempt these procedures. HP assumes you are qualified in the installation and servicing of computer equipment and trained in recognizing hazards in products with hazardous voltage levels.

Section	Page
HP BladeSystem c-Class Site Planning Guide	1
Notice	2
Contents	3
Introduction	6
About this document	6
Related documentation	6
General site preparation guidelines	7
ASHRAE guidelines for site planning	7
HP site planning assistance	7
Site planning considerations	8
Computer room preparation	8
Cooling requirements	9
Basic air conditioning equipment requirements	9
Air conditioning system guidelines	9
Air conditioning system types	9
Basic air distribution systems	10
Air conditioning system specifications	10
Air conditioning ducts	11
Cabling requirements	11
Floor loading	12
Raised floor loading	12
Average floor loading	12
Computer room safety	13
Installation and maintenance precautions	13
Fire protection	13
Fire suppression	13
Lighting requirements for equipment servicing	14
Working space for component access	14
Environmental requirements	15
Environmental elements	15
Humidity level	15
Dust and pollution	15
Metallic particulate contamination	16
Electrostatic discharge prevention	17
Acoustic noise specification	17
Recommended operating environment	18
Airflow requirements	19
Blanking panels	19
HP Rack Airflow Optimization Kit	19
Space requirements	19
Delivery space requirements	20
Operational space requirements	20
Equipment clearance and floor loading	20
Floor plan grid	21
HP BladeSystem enclosure environmental specifications	22
Rack and accessory footprints	22
Front door clearance	23
Best practices for deployment in rows	26
Rack placement and arrangement for proper airflow	27
Third-party racks	27
Rack tie-down option kit	28
Power requirements and considerations	29
Power requirements	29
Electrical factors	29
Power consumption	30
Electrical load requirements (circuit breaker sizing)	31
Power quality	32
Factors affecting power quality	32
Power system protection	32
Power considerations	32
Power options	33
Power redundancy	33
Non-redundant power	34
Line voltage selection	34
Distribution hardware	34
Wire selection	34
Raceway systems (electrical conduits) (LAHJ)	35
Building distribution	35
Grounding requirements	35
Grounding systems	35
Grounding and earth leakage current	35
Power distribution safety grounding (LAHJ)	36
Main building electrical ground	36
Conduit bonding	36
Power panel ground	36
Computer safety ground	36
Dual power source grounding	36
Cabinet performance grounding (high frequency ground)	37
Raised floor \	37
Equipment grounding implementation details	38
System installation guidelines	38
Wiring connections	38
Data communications cables	39
Power configuration	39
Dynamic Power Capping	39
HP BladeSystem enclosure single-phase power configuration	39
PDU installation	43
c7000 PDU example	43
c3000 PDU example	44
HP BladeSystem c7000 Enclosure three-phase AC configuration	45
HP BladeSystem enclosure DC power configuration	46
HP BladeSystem c7000 Enclosure DC configuration	46
HP BladeSystem c3000 Enclosure DC configuation	47
Power supply specifications	47
Single-phase HP 2250W Power Supply specification	47
Single-phase HP 2400W High Efficiency Power Supply specificification	48
Three-phase HP 2250W Power Supply specification (North America/Japan)	48
Three-phase HP 2400W High Efficiency Power Supply specification (North America/Japan)	49
Three-phase HP 2250W Power Supply specification (International)	49
Three-phase HP 2400W Power Supply specification (International)	50
DC power supply specification	50
Hardware specifications and requirements	51
Enclosure specifications	51
HP BladeSystem c7000 Enclosure specifications	51
HP BladeSystem c3000 Enclosure specifications	51
HP 10000 G2 rack specifications	52
Rack requirements	52
Rack-free environment requirements	53
Configuration scenarios	54
Example configurations	54
Example minimum configuration	54
Example typical configuration	54
Example maximum configuration	55
Estimating power and cooling	56
Estimating total weight	57
Preparing for installation	58
Warning, caution, and important messages	58
Additional rack considerations	60
General component placement guidelines	60
Rack configuration software	61
Sample installation schedule	62
Sample checklists	62
Delivery survey	64
Conversion factors and formulas	66
Conversion factors	66
Formulas	66
Technical support	67
Before you contact HP	67
HP contact information	67
Acronyms and abbreviations	68
Glossary	70

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The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express

warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP

shall not be liable for technical or editorial errors or omissions contained herein.

Intended audience

This document is for the person who plans for and installs HP BladeSystem c-Class products. Only persons

experienced in server blade technology and configuration should attempt these procedures. HP assumes

you are qualified in the installation and servicing of computer equipment and trained in recognizing

hazards in products with hazardous voltage levels.