HP Integrity Superdome 2 16-socket HP Integrity Superdome 2 User Service Guide - Page 21

System specifications, Dimensions and weights, Component dimensions, Component weights

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2 System specifications Dimensions and weights Component dimensions Table 1 Component dimensions Component Compute enclosure Server blade I/O expansion enclosure Width (in/cm) 17.6/44.7 2.02/5.13 17.2/43.7 Depth (in/cm) 32.6/82.8 19.69/50.01 22.5/57.2 Height (in/cm) 31.4/79.8 24.48/62.18 6.8/17.3 Component weights Table 2 Compute enclosure weights Component Compute enclosure chassis1 I/O chassis2 Weight (lb/kg) 143.0/64.9 48.7/22.1 Midplane Brick 41.5/18.8 Onboard Administrator tray 8.0/3.6 Active Cool Fan 2.7/0.9 Power supply module 5.0/2.3 DVD module 4.7/2.1 Onboard Administrator module 1.8/0.8 GPSM 2.6/1.2 XFM 7.3/3.3 I/O interconnect module3 2.9/1.3 1 Does not include I/O chassis or Midplane Brick. 2 Part of the enclosure assembly the XFM and I/O switch modules install into 3 Maximum weight for an interconnect module. Table 3 Other component weights Max quantity per enclosure 1 1 1 1 15 12 1 2 2 4 8 Component IOX enclosure1 Weight (lb/kg) 65.0/29.5 CB900s i2 or CB900s i4 Server Blade2 1 Fully loaded with all PCIe cards 2 Fully loaded with all DIMMs 35.0/15.9 For more information about general site preparation guidelines, see the Generic Site Preparation Guide. Dimensions and weights 21

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2 System specifications
Dimensions and weights
Component dimensions
Table 1 Component dimensions
Height (in/cm)
Depth (in/cm)
Width (in/cm)
Component
31.4/79.8
32.6/82.8
17.6/44.7
Compute enclosure
24.48/62.18
19.69/50.01
2.02/5.13
Server blade
6.8/17.3
22.5/57.2
17.2/43.7
I/O expansion enclosure
Component weights
Table 2 Compute enclosure weights
Max quantity per enclosure
Weight (lb/kg)
Component
1
143.0/64.9
Compute enclosure chassis
1
1
48.7/22.1
I/O chassis
2
1
41.5/18.8
Midplane Brick
1
8.0/3.6
Onboard Administrator tray
15
2.7/0.9
Active Cool Fan
12
5.0/2.3
Power supply module
1
4.7/2.1
DVD module
2
1.8/0.8
Onboard Administrator module
2
2.6/1.2
GPSM
4
7.3/3.3
XFM
8
2.9/1.3
I/O interconnect module
3
1
Does not include I/O chassis or Midplane Brick.
2
Part of the enclosure assembly the XFM and I/O switch modules install into
3
Maximum weight for an interconnect module.
Table 3 Other component weights
Weight (lb/kg)
Component
65.0/29.5
IOX enclosure
1
35.0/15.9
CB900s i2 or CB900s i4 Server Blade
2
1
Fully loaded with all PCIe cards
2
Fully loaded with all DIMMs
For more information about general site preparation guidelines, see the
Generic Site Preparation
Guide
.
Dimensions and weights
21