Intel E7500 Design Guide - Page 15

Thermal Specifications R 4 Thermal Specifications 4.1 Power See Table 1 for TDP specifications for the E7500 MCH. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solutions. Intel recommends that system designers plan for one or more heatsinks when using the E7500 chipset. 4.2 Die Temperature To ensure proper operation and reliability of the MCH, the die temperatures must be at or below the values specified for the MCH in Table 1. System or component level thermal solutions are required to maintain die temperatures below the maximum temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring package die temperatures. Table 1. Intel® E7500 MCH Thermal Specifications Parameter Maximum Tdie-hs TDP 102 °C 9.0 W NOTE: Tdie-hs is defined as the maximum die temperature with the reference thermal solution attached. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 15