Intel E7500 Design Guide - Page 23

Reference Thermal Solutions R 6.3 Thermal Solution Assembly The reference thermal solution is a passive extruded heatsink with thermal and mechanical interfaces. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 9 shows the reference thermal solution assembly and associated components. Figure 9 and Figure 10 show alternate views of the reference solution. Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B. Appendix A contains vendor information for each thermal solution component. Figure 9. Reference Thermal Solution Assembly Heatsin Thermal Anchored Mechanical Solder-Down FC-BGA ref_therm_solution_assy Intel® E7500 MCH Thermal and Mechanical Design Guidelines 23