Intel E7500 Design Guide - Page 19

Angle Attach Methodology Top View, Angle Attach Heatsink Modifications

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R Figure 5. 0° Angle Attach Methodology (Top View) Thermocouple Wire Thermal Metrology Die Substrate NOTE: Not to scale. Figure 6. 0° Angle Attach Heatsink Modifications Cement + Thermocouple Bead angle_attach_1 1.3 mm (0.05 in.) (0.5 mm (0.02 in.) Depth) NOTE: Not to scale. 3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in.) Depth) Angle_Attach_Heatsink_Mod Intel® E7500 MCH Thermal and Mechanical Design Guidelines 19

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Thermal Metrology
R
Intel
®
E7500 MCH Thermal and Mechanical Design Guidelines
19
Figure 5. 0° Angle Attach Methodology (Top View)
Cement +
Thermocouple Bead
angle_attach_1
Thermocouple Wire
Die
Substrate
NOTE:
Not to scale.
Figure 6. 0° Angle Attach Heatsink Modifications
Angle_Attach_Heatsink_Mod
1.3 mm (0.05 in.)
(0.5 mm (0.02 in.) Depth)
3.3 mm (0.13 in.) Diameter
(1.5 mm (0.06 in.) Depth)
NOTE:
Not to scale.