Intel E7500 Design Guide - Page 27

Reference Thermal Solutions R 6.3.3 Mechanical Interface Material Intel recommends the use of a mechanical interface material to avoid cracking of the exposed die under loading. The interface material reduces mechanical loads experienced by the die. The reference thermal solution uses a picture frame gasket of 0.813 mm (0.032 in.) thick Poron* foam. The foam gasket is a two-piece design with diagonal cuts at two corners as shown in Figure 15. A one-piece gasket design may be used instead without any impact to mechanical performance. Figure 15. Heatsink Mechanical Gasket, Optional Two-Piece 42.34 mm (1.667 in.) 42.34 mm (1.667 in.) 33.20 mm (1.307 in.) 0.81 mm (0.032 in.) 33.20 mm (1.307 in.) 6.3.4 6.3.5 NOTE: Not to scale. Heatsink_Gasket Thermal Interface Material A thermal interface material provides improved conductivity between the die and heatsink. The reference thermal solution uses Chomerics* T-710, 0.127 mm (0.005 in.) thick, 25.4 mm x 25.4 mm (1.0 in. x 1.0 in.) square. Heatsink Clip The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. See Figure 19 in Appendix B for a mechanical drawing of the clip. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 27