Intel E7500 Design Guide - Page 26

Reference Thermal Solutions R 6.3.2 Extruded Heatsink Profiles The E7500 chipset reference thermal solution uses an extruded heatsink for cooling the MCH. Figure 13 shows the heatsink profile. This document does not provide tolerance information. Check with your heatsink supplier for specific tolerances. Appendix A lists suppliers for the extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available, including the tall heatsink shown in Figure 14. Contact your heatsink supplier for information on alternate heatsinks. Figure 13. Extruded Heatsink Profile 3.05 mm (0.120 in.) 23.01 mm (0.906 in.) 42.34 mm (1.67 in.) NOTE: Not to scale. Figure 14. Alternate Tall Heatsink Profile Extr_Heasink_Profile 3.81 mm (0.150 in.) NOTE: Not to scale. 35.00 mm (1.38 in.) 42.34 mm (1.67 in.) Alt_Extr_Heatsink_Profile 26 Intel® E7500 MCH Thermal and Mechanical Design Guidelines