Intel MFSYS25 User Guide - Page 2

Copyright © 2007- 2010, Intel Corporation. All Rights Reserved, Materials by Intel - datasheet

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Disclaimer The source code contained or described herein and all documents related to the source code (Material) are owned by Intel Corporation or its suppliers or licensors. Title to the Material remains with Intel Corporation or its suppliers and licensors. The Material may contain trade secrets and proprietary and confidential information of Intel Corporation and its suppliers and licensors, and is protected by worldwide copyright and trade secret laws and treaty provisions. No part of the Material may be used, copied, reproduced, modified, published, uploaded, posted, transmitted, distributed, or disclosed in any way without Intel®'s prior express written permission. No license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the Materials, either expressly, by implication, inducement, estoppel or otherwise. Any license under such intellectual property rights must be express and approved by Intel® in writing. Unless otherwise agreed by Intel® in writing, you may not remove or alter this notice or any other notice embedded in Materials by Intel® or Intel®'s suppliers or licensors in any way. Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel®'s Terms and Conditions of Sale for such products, Intel® assumes no liability whatsoever, and Intel® disclaims any express or implied warranty, relating to sale and/or use of Intel® products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel® products are not designed, intended or authorized for use in any medical, life saving, or life sustaining applications or for any other application in which the failure of the Intel® product could create a situation where personal injury or death may occur. Intel® may make changes to specifications and product descriptions at any time, without notice. Intel® server boards contain a number of high-density VLSI and power delivery components that need adequate airflow for cooling. Intel®'s own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel® developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation can not be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Intel, Intel Core, and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright © 2007- 2010, Intel Corporation. All Rights Reserved

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Disclaimer
The source code contained or described herein and all documents related to the source code (Material) are owned
by Intel Corporation or its suppliers or licensors. Title to the Material remains with Intel Corporation or its suppliers
and licensors. The Material may contain trade secrets and proprietary and confidential information of Intel
Corporation and its suppliers and licensors, and is protected by worldwide copyright and trade secret laws and treaty
provisions. No part of the Material may be used, copied, reproduced, modified, published, uploaded, posted,
transmitted, distributed, or disclosed in any way without Intel
®
’s prior express written permission. No license under
any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by
disclosure or delivery of the Materials, either expressly, by implication, inducement, estoppel or otherwise. Any
license under such intellectual property rights must be express and approved by Intel
®
in writing.
Unless otherwise agreed by Intel
®
in writing, you may not remove or alter this notice or any other notice embedded in
Materials by Intel
®
or Intel
®
’s suppliers or licensors in any way.
Information in this document is provided in connection with Intel
®
products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel
®
’s
Terms and Conditions of Sale for such products, Intel
®
assumes no liability whatsoever, and Intel
®
disclaims any
express or implied warranty, relating to sale and/or use of Intel
®
products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel
®
products are not designed, intended or authorized for use in any medical, life saving, or life sustaining
applications or for any other application in which the failure of the Intel
®
product could create a situation where
personal injury or death may occur. Intel
®
may make changes to specifications and product descriptions at any time,
without notice.
Intel
®
server boards contain a number of high-density VLSI and power delivery components that need adequate
airflow for cooling. Intel
®
’s own chassis are designed and tested to meet the intended thermal requirements of these
components when the fully integrated system is used together. It is the responsibility of the system integrator that
chooses not to use Intel
®
developed server building blocks to consult vendor datasheets and operating parameters
to determine the amount of airflow required for their specific application and environmental conditions. Intel
Corporation can not be held responsible if components fail or the server board does not operate correctly when used
outside any of their published operating or non-operating limits.
Intel, Intel Core, and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2007- 2010, Intel Corporation. All Rights Reserved