Acer G330 Altos G330 User's Guide - Page 46

HSF assembly and the processor socket retention plate.

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36 3 System upgrade (3) Twist the HSF sightly to break the thermal grease bond loose. Once the thermal grease bond is broken, lift the HSF away from the mainboard. (4) Lay down the HSF in an upright position-with the thermal patch facing upward. Do not let the thermal patch touch the work surface. 5 Use an alcohol pad to wipe off the thermal grease from both the HSF assembly and the processor socket retention plate. 6 Remove the default processor. Warning! The processor becomes very hot when the system is on. Allow it to cool off first before handling. (1) Press down on the socket lever while pulling it towards the center of the mainboard to disengage it from the socket hook. (2) Fully open the load lever.

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3 System upgrade
36
(3)
Twist the HSF sightly to break the thermal grease bond loose.
Once the thermal grease bond is broken, lift the HSF away
from the mainboard.
(4)
Lay down the HSF in an upright position—with the thermal
patch facing upward.
Do not let the thermal patch touch the
work surface.
5
Use an alcohol pad to wipe off the thermal grease from both the
HSF assembly and the processor socket retention plate.
6
Remove the default processor.
Warning!
The processor becomes very hot when the
system is on.
Allow it to cool off first before handling.
(1)
Press down on the socket lever while pulling it towards the
center of the mainboard to disengage it from the socket hook.
(2)
Fully open the load lever.