Compaq 435 Maintenance and Service Guide - Page 95
A thermal pad is used on the graphics subsystem chip, services
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● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the FCH chip (3) and the heat sink section (4) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory. Component replacement procedures 87