HP Dc5850 Technical Reference Guide: HP Compaq dc5850 Series Business Desktop - Page 30
AMD Processors - cpu socket
UPC - 884962022993
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Processor/Memory Subsystem 3.2 AMD Processors These systems feature an AMD processor mounted with a heat sink in an AM2+ socket. The mounting socket allows the processor to be easily changed for upgrading. 3.2.1 AMD Processor Overview The systems covered in this guide support AMD Phenom, Athlon, and Sempron processors. Key features of these AMD processors include: ■ Single-, dual-, triple-, or quad-core architecture ■ Dedicated L2 cache for each core ■ Integrated DDR2 memory controller ■ Direct-connect archtitecture for improved performance between the CPU, memory, and I/O ■ HyperTransport™ technology providing up to 4 GB/s (each direction) in mode 1.0 and up to 7.2 GB/s in mode 3.0 Table 3-1 provides a sample listing of processors supported by these systems. AMD Processor Phenom X4 Phenom X3 Athlon 64 X2 Athlon 64 X2 Athlon 64 Sempron Table 3-1 Supported Processors (partial listing) Core design Core Speed HT bus mode L2 Cache L3 Cache quad 2.30 GHz 3.0 512 KB x4 2048 KB triple 2.40 GHz 3.0 512 KB x3 2048 KB dual 2.80 GHz 2.0 1024 KB x2 n/a dual 2.70 GHz 2.0 1024 KB x2 n/a single 2.40 GHz 2.0 1024 KB n/a single 2.30 GHz 1.0 512 KB n/a Instruction set support (see note) Std. set + SSE4a, Enhanced 3DNow! Std. set + SSE4a, Enhanced 3DNow! Std. set + AMD-V Std. set + AMD-V Std. set Std. set NOTE: Standard (std.) instruction set support includes AMD64, MMX, SSE, SSE2, SSE3, 3DNow!, NX bit, Cool'n'Quiet 3.2.2 Processor Changing/Upgrading These systems use the AM2+ zero-insertion-force mounting socket. These systems require that the processor use an integrated heatsink/fan assembly. CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such conditions could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions. CAUTION: These systems can only support a processor with a maximum power consumption (also known as thermal design power (TDP)) of 95 watts. Exceeding this limit can result in system damage and lost data. 3-2 www.hp.com Technical Reference Guide