HP Model 712/100 hp 9000 series 700 model 712 technical reference manual (a261 - Page 20

Air Flow, Technical Drawings and Schematics

Page 20 highlights

Air Flow The Model 712 workstation is cooled by forced convection. One dual-speed 80mm DC fan provides the airflow across the entire operating temperature range. Airflow is primarily front to back. The total airflow through the box is approximately 12 CFM, with about 3.6 CFM of that air going to the power supply. At 30C ambient temperature, the fan switches to its faster speed for more efficient cooling. In order to cool the bottom side of the system board, there are holes in the sheet metal chassis along the bottom edge to allow a small amount of air to travel under the processor. The PCX-L processor requires a heatsink. The heatsink is an extruded aluminum cross-cut design to maximize the heat dissipation. Technical Drawings and Schematics These drawings are available by request through your Hewlett-Packard Sales Representative. Ask for the drawings you need by referencing them by Name and Drawing Number. Table 1-8. Mechanical Drawings and Schematics Description System Board Blank System Board Schematic Video RAM Board Blank Teleshare Board Blank Token Ring Board Blank Embossed Nameplate Drawing Number D-A2263-66510-51 D-A2263-66510-40 B-A2263-26520-51 D-A2263-66530-51 D-A2263-66531-51 B-A2263-84005-10 Model 712 Technical Reference General Information 1-11

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Model 712 Technical Reference
General Information
Air Flow
The Model 712 workstation is cooled by forced convection. One dual-speed 80mm DC fan
provides the airflow across the entire operating temperature range. Airflow is primarily front
to back. The total airflow through the box is approximately 12 CFM, with about 3.6 CFM of
that air going to the power supply. At 30C ambient temperature, the fan switches to its faster
speed for more efficient cooling.
In order to cool the bottom side of the system board, there are holes in the sheet metal chassis
along the bottom edge to allow a small amount of air to travel under the processor. The
PCX-L processor requires a heatsink. The heatsink is an extruded aluminum cross-cut
design to maximize the heat dissipation.
Technical Drawings and Schematics
These drawings are available by request through your Hewlett-Packard Sales Representative.
Ask for the drawings you need by referencing them by Name and Drawing Number.
Table 1-8. Mechanical Drawings and Schematics
Description
Drawing Number
System Board Blank
System Board Schematic
V
ideo RAM Board Blank
T
eleshare Board Blank
Token Ring Board Blank
Embossed Nameplate
D–A2263–66510–51
D–A2263–66510–40
B–A2263–26520–51
D–A2263–66530–51
D–A2263–66531–51
B–A2263–84005–10