HP Pavilion 14-e000 HP Pavillion 14 Notebook PC Maintenance and Service Guide - Page 75

and the heat sink with the heat sink, processor, and system board spare part kits.

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5. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal paste is used on the VGA chip (3) and the heat sink section (4) that services it Component replacement procedures 65

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5.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is included
with the heat sink, processor, and system board spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal paste is used on the VGA chip
(3)
and the heat sink section
(4)
that services it
Component replacement procedures
65