HP Pavilion 15-bk000 Maintenance and Service Guide - Page 53
that services it. The following, that services it. Thermal material
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4. Remove the fan/heat sink assembly (3). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed. Thermal material is used on the processor (1) and the heat sink section (2) that services it. Thermal material is also used on the graphics subsystem chip (3) and the heat sink section (4) that services it. The following illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with discrete memory. Component replacement procedures 45
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4.
Remove the fan/heat sink assembly
(3)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board each time the fan/heat sink assembly is removed.
Thermal material is used on the processor
(1)
and the heat sink section
(2)
that services it. Thermal material
is also used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem
with discrete memory.
Component replacement procedures
45