HP Pavilion 17-e100 Pavilion 17 TouchSmart Notebook PC Pavilion 17 Notebook PC - Page 102

locations. A thermal pad is used on the PCA

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2. Remove the PCH heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the PCH heat sink and system board, it may be necessary to move the PCH heat sink from side to side to detach it. The thermal material must be thoroughly cleaned from the surfaces of the PCH heat sink and the PCH each time the PCH heat sink is removed. Replacement thermal material is included with the PCH heat sink and system board spare part kits. NOTE: The following illustration shows the PCH heat sink replacement thermal material locations. A thermal pad is used on the PCA (1) and the PCH heat sink (2). Reverse this procedure to install the PCH heat sink. 92 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts

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2.
Remove the PCH heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the PCH heat sink
and system board, it may be necessary to move the PCH heat sink from side to side to detach it.
The thermal material must be thoroughly cleaned from the surfaces of the PCH heat sink and
the PCH each time the PCH heat sink is removed. Replacement thermal material is included
with the PCH heat sink and system board spare part kits.
NOTE:
The following illustration shows the PCH heat sink replacement thermal material
locations. A thermal pad is used on the PCA
(1)
and the PCH heat sink
(2)
.
Reverse this procedure to install the PCH heat sink.
92
Chapter 6
Removal and replacement procedures for Authorized Service Provider parts