HP Pavilion 17-e100 Pavilion 17 TouchSmart Notebook PC Pavilion 17 Notebook PC - Page 92
Steps 3 and 4 apply to computer models equipped with a graphics subsystem
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2. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: Steps 3 and 4 apply to computer models equipped with a graphics subsystem with UMA memory. 3. Following the 1 through 4 sequence stamped into the heat sink, loosen the four captive Phillips screws (1) that secure the heat sink to the system board. 82 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
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2.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
Steps 3 and 4 apply to computer models equipped with a graphics subsystem with
UMA memory.
3.
Following the 1 through 4 sequence stamped into the heat sink, loosen the four captive Phillips
screws
(1)
that secure the heat sink to the system board.
82
Chapter 6
Removal and replacement procedures for Authorized Service Provider parts