HP Pavilion 17-e100 Pavilion 17 TouchSmart Notebook PC Pavilion 17 Notebook PC - Page 93

and the heat sink included with the heat sink, processor, and system board spare part kits.

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4. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal paste is used on the graphics chip (3) and the heat sink section (4) that services it Component replacement procedures 83

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4.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink, processor, and system board spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal paste is used on the graphics chip
(3)
and the heat sink section
(4)
that services it
Component replacement procedures
83