HP Pavilion g7 HP Pavilion g7 Notebook PC - Maintenance and Service Guide - Page 88

that secure the fan and heat sink to the, Remove the three Phillips PM2.5×6.0 screws

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● Top cover (see Top cover on page 57) ● System board (see System board on page 73) Remove the fan and heat sink: 1. Turn the system board upside down, with the fan toward you. NOTE: Steps 2 through 5 apply only to computer models equipped with a graphics subsystem with discrete memory. See steps 6 through 8 for fan and heat sink removal information for computer models equipped with a graphics subsystem with UMA memory. 2. Disconnect the fan cable (1) from the system board. 3. Loosen the captive screws (2) that secure the fan and heat sink to the system board. (Computer models equipped with an AMD processor have three captive screws. Computer models equipped with an Intel processor have four captive screws.) 4. Remove the three Phillips PM2.5×6.0 screws (3) that secure the fan and heat sink to the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach it. 80 Chapter 4 Removal and replacement procedures

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●
Top cover (see
Top cover
on page
57
)
●
System board (see
System board
on page
73
)
Remove the fan and heat sink:
1.
Turn the system board upside down, with the fan toward you.
NOTE:
Steps 2 through 5 apply only to computer models equipped with a graphics subsystem
with discrete memory. See steps 6 through 8 for fan and heat sink removal information for
computer models equipped with a graphics subsystem with UMA memory.
2.
Disconnect the fan cable
(1)
from the system board.
3.
Loosen the captive screws
(2)
that secure the fan and heat sink to the system board. (Computer
models equipped with an AMD processor have three captive screws. Computer models equipped
with an Intel processor have four captive screws.)
4.
Remove the three Phillips PM2.5×6.0 screws
(3)
that secure the fan and heat sink to the
system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to
detach it.
80
Chapter 4
Removal and replacement procedures