HP Pavilion g7 HP Pavilion g7 Notebook PC - Maintenance and Service Guide - Page 92
and the heat sink
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NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and Northbridge chip and the heat sink section (2) that services them ● A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with UMA memory. Thermal paste is used on the processor (1) and Northbridge chip and the heat sink section (2) that services them. 84 Chapter 4 Removal and replacement procedures
NOTE:
The following illustration shows the replacement thermal material locations on a
computer model equipped with an Intel processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and Northbridge chip and the heat sink section
(2)
that services them
●
A thermal pad is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
NOTE:
The following illustration shows the replacement thermal material locations on a
computer model equipped with an Intel processor and a graphics subsystem with UMA memory.
Thermal paste is used on the processor
(1)
and Northbridge chip and the heat sink section
(2)
that services them.
84
Chapter 4
Removal and replacement procedures