HP Pavilion g7 HP Pavilion g7 Notebook PC - Maintenance and Service Guide - Page 91

that services it, and the heat sink

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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, fan, heat sink, processor, and system board spare part kits. Replacement thermal material is also available in the Thermal Material Kit, spare part number 634433-001. NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it ● A thermal pad is used on the graphics subsystem chip (5) and the heat sink section (6) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with UMA memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it Component replacement procedures 83

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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, fan, heat sink, processor, and system board spare part kits.
Replacement thermal material is also available in the Thermal Material Kit, spare part number
634433-001.
NOTE:
The following illustration shows the replacement thermal material locations on a
computer model equipped with an AMD processor and a graphics subsystem with
discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the Northbridge chip
(3)
and the heat sink section
(4)
that
services it
●
A thermal pad is used on the graphics subsystem chip
(5)
and the heat sink section
(6)
that
services it
NOTE:
The following illustration shows the replacement thermal material locations on a
computer model equipped with an AMD processor and a graphics subsystem with UMA memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the Northbridge chip
(3)
and the heat sink section
(4)
that
services it
Component replacement procedures
83