HP Spectre XT TouchSmart Ultrabook CTO 15t-4000 HP SpectreXT TouchSmart Mainte - Page 74

the system board components each time the heat sink is removed. Replacement thermal material is

Get HP Spectre XT TouchSmart Ultrabook CTO 15t-4000 PDF manuals and user guides View all HP Spectre XT TouchSmart Ultrabook CTO 15t-4000 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 74 highlights

Remove the heat sink: 1. Following the 1, 2, 3, 4 sequence stamped into the heat sink, remove the four Phillips PM2.0×4.5 screws (1) that secure the heat sink to the system board. 2. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink and system board spare part kits. Thermal paste is used on the processor (1) and the section of the heat sink (2) that services it. 66 Chapter 4 Removal and replacement procedures

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
Remove the heat sink:
1.
Following the 1, 2, 3, 4 sequence stamped into the heat sink, remove the four Phillips PM2.0×4.5
screws
(1)
that secure the heat sink to the system board.
2.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink and system board spare part kits. Thermal paste is used on the processor
(1)
and the section of the heat sink
(2)
that services it.
66
Chapter 4
Removal and replacement procedures