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Intel Processor Support

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System Overview 2.3.1 Intel Processor Support The models covered in this guide are designed to support the following processor types: ■ Intel Celeron: energy-efficient single-core performance ■ Intel Pentium Dual-Core: Dual core performance ■ Intel Core2 Duo: energy-efficient dual-core performance ■ Intel Core2 Quad: energy efficient quad-core design These processors are backward-compatible with software written for earlier x86 microprocessors and include streaming SIMD extensions (SSE, SSE2, and SSE3) for enhancing 3D graphics and speech processing performance. The system board includes a zero-insertion-force (ZIF) Socket-T designed for mounting an LGA775-type processor package. CAUTION: The USDT form factor can support a processor rated up to 65 watts. The SFF and CMT form factors can support a processor rated up to 95 watts. Exceeding these limits can result in system damage and lost data. ✎ The processor heatsink/fan assembly mounting differs between form factors. Always use the same assembly or one of the same type when replacing the processor. Refer to the applicable Service Reference Guide for detailed removal and replacement procedures of the heatsink/fan assembly and the processor. 2-6 www.hp.com Technical Reference Guide

Section	Page
Title	1
Table of Contents	3
Chapter 1: Introduction	7
1.1 About this Guide	7
1.1.1 Online Viewing	7
1.1.2 Hardcopy	7
1.2 Additional Information Sources	7
1.3 Model Numbering Convention	7
1.4 Serial Number	9
1.5 Notational Conventions	9
1.5.1 Special Notices	9
1.5.2 Values	9
1.5.3 Ranges	9
1.6 Common Acronyms and Abbreviations	10
Chapter 2: System Overview	17
2.1 Introduction	17
2.2 Features	18
2.3 System Architecture	20
2.3.1 Intel Processor Support	22
2.3.2 Chipset	23
2.3.3 Support Components	24
2.3.4 System Memory	24
2.3.5 Mass Storage	25
2.3.6 Serial and Parallel Interfaces	25
2.3.7 Universal Serial Bus Interface	25
2.3.8 Network Interface Controller	25
2.3.9 Graphics Subsystem	26
2.3.10 Audio Subsystem	26
2.4 Specifications	27
Chapter 3: Processor/Memory Subsystem	33
3.1 Introduction	33
3.2 Intel Processors	34
3.2.1 Intel Processor Overview	34
3.2.2 Processor Changing/Upgrading	35
3.3 Memory Subsystem	36
3.3.1 Memory Upgrading	37
3.3.2 Memory Mapping and Pre-allocation	37
Chapter 4: System Support	39
4.1 Introduction	39
4.2 PCI Bus Overview	39
4.2.1 PCI 2.3 Bus Operation	39
4.2.2 PCI Express Bus Operation	41
4.2.3 Option ROM Mapping	42
4.2.4 PCI Interrupts	42
4.2.5 PCI Power Management Support	42
4.2.6 PCI Connectors	43
4.3 System Resources	45
4.3.1 Interrupts	45
4.3.2 Direct Memory Access	46
4.4 Real-Time Clock and Configuration Memory	47
4.4.1 Clearing CMOS	47
4.4.2 Standard CMOS Locations	48
4.5 System Management	48
4.5.1 Security Functions	48
4.5.2 Power Management	50
4.5.3 System Status	51
4.5.4 Thermal Sensing and Cooling	51
4.6 Register Map and Miscellaneous Functions	52
4.6.1 System I/O Map	52
4.6.2 GPIO Functions	53
Chapter 5: Input/Output Interfaces	55
5.1 Introduction	55
5.2 SATA Interface	56
5.3 PATA Interface	57
5.4 Diskette Drive Interface	58
5.5 Serial Interface	60
5.6 Parallel Interface	61
5.6.1 Standard Parallel Port Mode	61
5.6.2 Enhanced Parallel Port Mode	61
5.6.3 Extended Capabilities Port Mode	61
5.6.4 Parallel Interface Connector	62
5.7 Keyboard/Pointing Device Interface	63
5.7.1 Keyboard Interface Operation	63
5.7.2 Pointing Device Interface Operation	64
5.7.3 Keyboard/Pointing Device Interface Connector	64
5.8 Universal Serial Bus Interface	65
5.8.1 USB Connector	65
5.8.2 USB Cable Data	66
5.9 Audio Subsystem	67
5.9.1 HD Audio Controller	68
5.9.2 HD Audio Link Bus	68
5.9.3 Audio Multistreaming	68
5.9.4 Audio Specifications	69
5.10 Network Interface Controller	70
5.10.1 Wake-On-LAN Support	71
5.10.2 Alert Standard Format Support	71
5.10.3 Power Management Support	71
5.10.4 NIC Connector	72
5.10.5 NIC Specifications	72
Chapter 6: Integrated Graphics	73
6.1 Introduction	73
6.2 Functional Description	74
6.3 Display Modes	76
6.4 Upgrading	77
6.5 Monitor Connectors	78
6.5.1 Analog Monitor Connector	78
6.5.2 Digital Monitor Connector	79
Chapter 7: Power and Signal Distribution	81
7.1 Introduction	81
7.2 Power Distribution	81
7.2.1 USDT Power Distribution	81
7.2.2 SFF Power Distribution	82
7.2.3 CMT Power Distribution	84
7.2.4 Energy Star Compliancy	85
7.3 Power Control	86
7.3.1 Power Button	86
7.3.2 Wake Up Events	88
7.3.3 Power Management	89
7.4 Signal Distribution	90
Chapter 8: System BIOS	93
8.1 Introduction	93
8.2 ROM Flashing	94
8.2.1 Upgrading	94
8.2.2 Changeable Splash Screen	94
8.3 Boot Functions	95
8.3.1 Boot Device Order	95
8.3.2 Network Boot (F12) Support	95
8.3.3 Memory Detection and Configuration	95
8.3.4 Boot Error Codes	96
8.4 Client Management Functions	97
8.4.1 System ID and ROM Type	98
8.4.2 Temperature Status	98
8.4.3 Drive Fault Prediction	98
8.5 SMBIOS	99
8.6 USB Legacy Support	100
8.7 Management Engine Functions	100

Match case Limit results 1 per page

2-6

www.hp.com

Technical Reference Guide

System Overview

2.3.1 Intel Processor Support

The models covered in this guide are designed to support the following processor types:

■

Intel Celeron: energy-efficient single-core performance

■

Intel Pentium Dual-Core: Dual core performance

■

Intel Core2 Duo: energy-efficient dual-core performance

■

Intel Core2 Quad: energy efficient quad-core design

These processors are backward-compatible with software written for earlier x86 microprocessors

and include streaming SIMD extensions (SSE, SSE2, and SSE3) for enhancing 3D graphics and

speech processing performance.

The system board includes a zero-insertion-force (ZIF) Socket-T designed for mounting an

LGA775-type processor package.

CAUTION:

The USDT form factor can support a processor rated up to 65 watts. The SFF and CMT form

factors can support a processor rated up to 95 watts. Exceeding these limits can result in system damage

and lost data.

✎

The processor heatsink/fan assembly mounting differs between form factors. Always use the

same assembly or one of the same type when replacing the processor. Refer to the applicable

Service Reference Guide for detailed removal and replacement procedures of the heatsink/fan

assembly and the processor.