HP dc73 Technical Reference Guide: HP Compaq dc7800 Series Business Desktop Co - Page 35

Processor Changing/Upgrading

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Processor/Memory Subsystem 3.2.2 Processor Changing/Upgrading All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the processor use an integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan assembly as the original to ensure proper cooling. The heatsink and attachment clip are specially designed provide maximum heat transfer from the processor component. CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such a condition could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions. These sysems are available with one of the following processors listed in Table 3-1. Intel Model Q6700 Q6600 E6850 E6750 E6550 E4500 E4400 E2180 E2160 440 Core design quad quad dual dual dual dual dual dual dual single Table 3-1 Supported Processors Features Clock Speed in GHz FSB Speed in MHz VT, [1] 2.66 1066 VT, [1] 2.40 1066 vPro, VT, TXT, [1] 3.00 1333 vPro, VT, TXT, [1] 2.66 1333 vPro, VT, TXT, [1] 2.33 1333 [1] 2.20 800 [1] 2.00 800 [1] 2.00 800 [1] 1.80 800 [1] 2.00 800 L2 Cache 8 MB 8 MB 4 MB 4 MB 4 MB 2 MB 2 MB 1 MB 1 MB 512 KB Form Factor support SFF, CMT SFF, CMT all all all all all all all all NOTE: [1] Standard Intel feature set including EM64T, XD, and EIST support. Refer to www.Intel.com for detailed information. CAUTION: The USDT form factor can support a processor with a maximum power consumption of 65 watts. The SFF and CMT form factors can support a processor with a maximum power consumption of 95 watts. Exceeding these limits can result in system damage and lost data. Technical Reference Guide www.hp.com 3-3

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Technical Reference Guide
www.hp.com
3-3
Processor/Memory Subsystem
3.2.2 Processor Changing/Upgrading
All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the
processor use an integrated heatsink/fan assembly. A replacement processor must use the same
type heatsink/fan assembly as the original to ensure proper cooling. The heatsink and attachment
clip are specially designed provide maximum heat transfer from the processor component.
CAUTION:
Attachment of the heatsink to the processor is critical on these systems. Improper attachment
of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal
conditions and automatically shut down, such a condition could still result in damage to the processor
component. Refer to the applicable Service Reference Guide for processor installation instructions.
These sysems are available with one of the following processors listed in Table 3-1.
NOTE:
[1] Standard Intel feature set including EM64T, XD, and EIST support. Refer to www.Intel.com for
detailed information.
CAUTION:
The USDT form factor can support a processor with a maximum power consumption of 65
watts. The SFF and CMT form factors can support a processor with a maximum power consumption of 95
watts. Exceeding these limits can result in system damage and lost data.
Table 3-1
Supported Processors
Intel
Model
Core
design
Features
Clock
Speed
in GHz
FSB
Speed
in MHz
L2
Cache
Form
Factor
support
Q6700
quad
VT, [1]
2.66
1066
8 MB
SFF, CMT
Q6600
quad
VT, [1]
2.40
1066
8 MB
SFF, CMT
E6850
dual
vPro, VT, TXT, [1]
3.00
1333
4 MB
all
E6750
dual
vPro, VT, TXT, [1]
2.66
1333
4 MB
all
E6550
dual
vPro, VT, TXT, [1]
2.33
1333
4 MB
all
E4500
dual
[1]
2.20
800
2 MB
all
E4400
dual
[1]
2.00
800
2 MB
all
E2180
dual
[1]
2.00
800
1 MB
all
E2160
dual
[1]
1.80
800
1 MB
all
440
single
[1]
2.00
800
512 KB
all