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Power and Signal Distribution

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7 Power and Signal Distribution 7.1 Introduction This chapter describes the power supplies and discusses the methods of general power and signal distribution. Topics covered in this chapter include: ■ Power distribution (7.2) ■ Power Control (7.3) ■ Signal distribution (7.4) 7.2 Power Distribution Each form factor uses a unique power supply assembly and implements different methods of power generation and distribution. The USDT form factor uses an external ("brick") supply while the SFF and CMT form factors use a power supply unit contained within the system chassis. The subassemblies are not interchangeable between the three form factors. 7.2.1 USDT Power Distribution The USDT form factor uses an external ("brick") supply that connects to the chassis through a three-conductor cable (Figure 7-1). All voltages required by the processing circuits, peripherals, and storage devices are produced on the system board from the 19.0 VDC produced by the extrernal power supply assembly. The external power supply always produces 19.0 VDC as long as it is connected to an active AC outlet. Front Bezel Power Button USDT Chassis System Board Power On Power Logic, Voltage Regulators 90 - 264 VAC +19.0 Rtn VDC Pwr rating & ID External Power Supply Unit Figure 7-1. USDT Power Generation, Block Diagram Technical Reference Guide www.hp.com 7-1

Section	Page
Title	1
Table of Contents	3
Chapter 1: Introduction	7
1.1 About this Guide	7
1.1.1 Online Viewing	7
1.1.2 Hardcopy	7
1.2 Additional Information Sources	7
1.3 Model Numbering Convention	7
1.4 Serial Number	9
1.5 Notational Conventions	9
1.5.1 Special Notices	9
1.5.2 Values	9
1.5.3 Ranges	9
1.6 Common Acronyms and Abbreviations	10
Chapter 2: System Overview	17
2.1 Introduction	17
2.2 Features	18
2.3 System Architecture	20
2.3.1 Intel Processor Support	22
2.3.2 Chipset	23
2.3.3 Support Components	24
2.3.4 System Memory	24
2.3.5 Mass Storage	25
2.3.6 Serial and Parallel Interfaces	25
2.3.7 Universal Serial Bus Interface	25
2.3.8 Network Interface Controller	25
2.3.9 Graphics Subsystem	26
2.3.10 Audio Subsystem	26
2.4 Specifications	27
Chapter 3: Processor/Memory Subsystem	33
3.1 Introduction	33
3.2 Intel Processors	34
3.2.1 Intel Processor Overview	34
3.2.2 Processor Changing/Upgrading	35
3.3 Memory Subsystem	36
3.3.1 Memory Upgrading	37
3.3.2 Memory Mapping and Pre-allocation	37
Chapter 4: System Support	39
4.1 Introduction	39
4.2 PCI Bus Overview	39
4.2.1 PCI 2.3 Bus Operation	39
4.2.2 PCI Express Bus Operation	41
4.2.3 Option ROM Mapping	42
4.2.4 PCI Interrupts	42
4.2.5 PCI Power Management Support	42
4.2.6 PCI Connectors	43
4.3 System Resources	45
4.3.1 Interrupts	45
4.3.2 Direct Memory Access	46
4.4 Real-Time Clock and Configuration Memory	47
4.4.1 Clearing CMOS	47
4.4.2 Standard CMOS Locations	48
4.5 System Management	48
4.5.1 Security Functions	48
4.5.2 Power Management	50
4.5.3 System Status	51
4.5.4 Thermal Sensing and Cooling	51
4.6 Register Map and Miscellaneous Functions	52
4.6.1 System I/O Map	52
4.6.2 GPIO Functions	53
Chapter 5: Input/Output Interfaces	55
5.1 Introduction	55
5.2 SATA Interface	56
5.3 PATA Interface	57
5.4 Diskette Drive Interface	58
5.5 Serial Interface	60
5.6 Parallel Interface	61
5.6.1 Standard Parallel Port Mode	61
5.6.2 Enhanced Parallel Port Mode	61
5.6.3 Extended Capabilities Port Mode	61
5.6.4 Parallel Interface Connector	62
5.7 Keyboard/Pointing Device Interface	63
5.7.1 Keyboard Interface Operation	63
5.7.2 Pointing Device Interface Operation	64
5.7.3 Keyboard/Pointing Device Interface Connector	64
5.8 Universal Serial Bus Interface	65
5.8.1 USB Connector	65
5.8.2 USB Cable Data	66
5.9 Audio Subsystem	67
5.9.1 HD Audio Controller	68
5.9.2 HD Audio Link Bus	68
5.9.3 Audio Multistreaming	68
5.9.4 Audio Specifications	69
5.10 Network Interface Controller	70
5.10.1 Wake-On-LAN Support	71
5.10.2 Alert Standard Format Support	71
5.10.3 Power Management Support	71
5.10.4 NIC Connector	72
5.10.5 NIC Specifications	72
Chapter 6: Integrated Graphics	73
6.1 Introduction	73
6.2 Functional Description	74
6.3 Display Modes	76
6.4 Upgrading	77
6.5 Monitor Connectors	78
6.5.1 Analog Monitor Connector	78
6.5.2 Digital Monitor Connector	79
Chapter 7: Power and Signal Distribution	81
7.1 Introduction	81
7.2 Power Distribution	81
7.2.1 USDT Power Distribution	81
7.2.2 SFF Power Distribution	82
7.2.3 CMT Power Distribution	84
7.2.4 Energy Star Compliancy	85
7.3 Power Control	86
7.3.1 Power Button	86
7.3.2 Wake Up Events	88
7.3.3 Power Management	89
7.4 Signal Distribution	90
Chapter 8: System BIOS	93
8.1 Introduction	93
8.2 ROM Flashing	94
8.2.1 Upgrading	94
8.2.2 Changeable Splash Screen	94
8.3 Boot Functions	95
8.3.1 Boot Device Order	95
8.3.2 Network Boot (F12) Support	95
8.3.3 Memory Detection and Configuration	95
8.3.4 Boot Error Codes	96
8.4 Client Management Functions	97
8.4.1 System ID and ROM Type	98
8.4.2 Temperature Status	98
8.4.3 Drive Fault Prediction	98
8.5 SMBIOS	99
8.6 USB Legacy Support	100
8.7 Management Engine Functions	100

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7-1

Power and Signal Distribution

7.1

Introduction

This chapter describes the power supplies and discusses the methods of general power and signal

distribution. Topics covered in this chapter include:

■

Power distribution (7.2)

■

Power Control (7.3)

■

Signal distribution (7.4)

7.2 Power Distribution

Each form factor uses a unique power supply assembly and implements different methods of

power generation and distribution. The USDT form factor uses an external (“brick”) supply

while the SFF and CMT form factors use a power supply unit contained within the system

chassis. The subassemblies are not interchangeable between the three form factors.

7.2.1 USDT Power Distribution

The USDT form factor uses an external (“brick”) supply that connects to the chassis through a

three-conductor cable (Figure 7-1). All voltages required by the processing circuits, peripherals,

and storage devices are produced on the system board from the 19.0 VDC produced by the

extrernal power supply assembly. The external power supply always produces 19.0 VDC as long

as it is connected to an active AC outlet.

Figure 7-1. USDT Power Generation, Block Diagram

System Board

Power Supply

Power On

Power Logic,

Front Bezel

Voltage Regulators

Unit

Power Button

+19.0

USDT Chassis

90 - 264 VAC

Rtn

Pwr rating

& ID

VDC

External