IBM 2658 Hardware Maintenance Manual - Page 214

I/O Port Bracket Disassembly,

Page 214 highlights

2. In step 2, further pull out this latch before the system board is attached to the lower case. 3. Thermal Pad must be replaced when either Heat Sink Module, CPU or System Board is replaced. Thermal Pad is stuck on the bottom side of Heat Sink Module with adhesive. Do not re-use the thermal pad. 1260 I/O Port Bracket Disassembly v "1010 Battery Disassembly" on page 183 v "1020 Mini-PCI cover and Mini-PCI card Disassembly" on page 184 v "1040 Hard Disk Drive Disassembly" on page 186 v "1060 CD-ROM Disassembly" on page 187 v "1070 Keyboard Disassembly" on page 188 v "1100 Middle Cover Disassembly" on page 191 v "1110 CDC Cover Disassembly" on page 192 v "1170 LCD Disassembly" on page 197 v "1180 Keyboard bezel Disassembly" on page 198 v "1240 Speaker Disassembly" on page 205 v "1250 System Board Disassembly" on page 206 1 2 Step 1 2 Size (Quantity) M2.5 x L6 M2 x L12 Color Silver Silver 208 ThinkPad R32 Series Torque 3.2 kgf-cm 1.6 kgf-cm

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2.
In step 2, further pull out this latch before the system
board is attached to the lower case.
3.
Thermal Pad must be replaced when either Heat Sink
Module, CPU or System Board is replaced. Thermal
Pad is stuck on the bottom side of Heat Sink Module
with adhesive. Do not re-use the thermal pad.
1260 I/O Port Bracket Disassembly
v
1010 Battery Disassembly
on page 183
v
1020 Mini-PCI cover and Mini-PCI card Disassembly
on page 184
v
1040 Hard Disk Drive Disassembly
on page 186
v
1060 CD-ROM Disassembly
on page 187
v
1070 Keyboard Disassembly
on page 188
v
1100 Middle Cover Disassembly
on page 191
v
1110 CDC Cover Disassembly
on page 192
v
1170 LCD Disassembly
on page 197
v
1180 Keyboard bezel Disassembly
on page 198
v
1240 Speaker Disassembly
on page 205
v
1250 System Board Disassembly
on page 206
1
2
Step
Size (Quantity)
Color
Torque
1
M2.5 x L6
Silver
3.2 kgf-cm
2
M2 x L12
Silver
1.6 kgf-cm
208
ThinkPad R32 Series