Intel D925XHY D925XHY Technical Product Specification - Page 66

Thermal Considerations

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Intel Desktop Board D925XHY Technical Product Specification 2.12 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heatsink that provides omni-directional airflow (as shown in Figure 23) to maintain required airflow across the processor voltage regulator area. OM16996 Figure 23. Processor Heatsink for Omni-directional Airflow CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. 66

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Intel Desktop Board D925XHY Technical Product Specification
66
2.12 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38
o
C at the processor fan inlet is a
requirement.
Use a processor heatsink that provides omni-directional airflow (as shown in
Figure 23) to maintain required airflow across the processor voltage regulator area.
OM16996
Figure 23.
Processor Heatsink for Omni-directional Airflow
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board.
For a list of chassis that have
been tested with Intel desktop boards please refer to the following website:
All responsibility for determining the adequacy of any thermal or system design remains solely with
the reader.
Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.