Intel E1400 Design Guidelines - Page 5

A.2.1 Heatsink Preload Requirement Limitations 75 A.2.2 Motherboard Deflection Metric Definition 76 A.2.3 Board Deflection Limits 77 A.2.4 Board Deflection Metric Implementation Example 78 A.2.5 Additional Considerations 79 A.3 Heatsink Selection Guidelines 80 Appendix B Heatsink Clip Load Metrology 81 B.1 Overview 81 B.2 Test Preparation 81 B.2.1 Heatsink Preparation 81 B.2.2 Typical Test Equipment 84 B.3 Test Procedure Examples 84 B.3.1 Time-Zero, Room Temperature Preload Measurement 85 B.3.2 Preload Degradation under Bake Conditions 85 Appendix C Thermal Interface Management 87 C.1 Bond Line Management 87 C.2 Interface Material Area 87 C.3 Interface Material Performance 87 Appendix D Case Temperature Reference Metrology 89 D.1 Objective and Scope 89 D.2 Supporting Test Equipment 89 D.3 Thermal Calibration and Controls 91 D.4 IHS Groove 91 D.5 Thermocouple Attach Procedure 95 D.5.1 D.5.2 D.5.3 D.5.4 Thermocouple Conditioning and Preparation 95 Thermocouple Attachment to the IHS 96 Solder Process 101 Cleaning and Completion of Thermocouple Installation 105 D.6 Thermocouple Wire Management 108 Appendix E Appendix F Legacy Fan Speed Control 109 E.1 Thermal Solution Design 109 E.1.1 E.1.2 Determine Thermistor Set Points 109 Minimum Fan Speed Set Point 110 E.2 Board and System Implementation 111 E.2.1 Choosing Fan Speed Control Settings 111 E.3 Combining Thermistor and On-Die Thermal Sensor Control 115 E.4 Interaction of Thermal Profile and TCONTROL 115 Balanced Technology Extended (BTX) System Thermal Considerations 121 Appendix G Fan Performance for Reference Design 125 Appendix H Mechanical Drawings 128 Appendix I Intel Enabled Reference Solution Information 146 Thermal and Mechanical Design Guidelines 5