Intel E1400 Design Guidelines - Page 7

System Airflow Illustration with System Monitor Point Area Identified . 122

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Page 7 highlights

Figure 7-21. Detailed Thermocouple Bead Placement 98 Figure 7-22. Third Tape Installation 98 Figure 7-23. Measuring Resistance Between Thermocouple and IHS 99 Figure 7-24. Applying Flux to the Thermocouple Bead 100 Figure 7-25. Cutting Solder 100 Figure 7-26. Positioning Solder on IHS 101 Figure 7-27. Solder Station Setup 102 Figure 7-28. View Through Lens at Solder Station 103 Figure 7-29. Moving Solder back onto Thermocouple Bead 103 Figure 7-30. Removing Excess Solder 104 Figure 7-31. Thermocouple placed into groove 105 Figure 7-32. Removing Excess Solder 105 Figure 7-33. Filling Groove with Adhesive 106 Figure 7-34. Application of Accelerant 106 Figure 7-35. Removing Excess Adhesive from IHS 107 Figure 7-36. Finished Thermocouple Installation 107 Figure 7-37. Thermocouple Wire Management 108 Figure 7-38. Thermistor Set Points 110 Figure 7-39. Example Fan Speed Control Implementation 111 Figure 7-40. Fan Speed Control 112 Figure 7-41. Temperature Range = 5 °C 113 Figure 7-42. Temperature Range = 10 °C 114 Figure 7-43. On-Die Thermal Sensor and Thermistor 115 Figure 7-44. FSC Definition Example 117 Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified . 122 Figure 7-46. Thermal sensor Location Illustration 123 Figure 7-47. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 1 129 Figure 7-48. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 2 130 Figure 7-49. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 3 131 Figure 7-50. BTX Thermal Module Keep Out Volumetric - Sheet 1 132 Figure 7-51. BTX Thermal Module Keep Out Volumetric - Sheet 2 133 Figure 7-52. BTX Thermal Module Keep Out Volumetric - Sheet 3 134 Figure 7-53. BTX Thermal Module Keep Out Volumetric - Sheet 4 135 Figure 7-54. BTX Thermal Module Keep Out Volumetric - Sheet 5 136 Figure 7-55. ATX Reference Clip - Sheet 1 137 Figure 7-56. ATX Reference Clip - Sheet 2 138 Figure 7-57. Reference Fastener - Sheet 1 139 Figure 7-58. Reference Fastener - Sheet 2 140 Figure 7-59. Reference Fastener - Sheet 3 141 Figure 7-60. Reference Fastener - Sheet 4 142 Figure 7-61. Intel® D60188-001 Reference Solution Assembly 143 Figure 7-62. Intel® D60188-001 Reference Solution Heatsink 144 Figure 7-63. Intel® E18764-001 Reference Solution Assembly 145 Thermal and Mechanical Design Guidelines 7

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Thermal and Mechanical Design Guidelines
7
Figure 7-21. Detailed Thermocouple Bead Placement
...........................................
98
Figure 7-22. Third Tape Installation
...................................................................
98
Figure 7-23. Measuring Resistance Between Thermocouple and IHS
.......................
99
Figure 7-24. Applying Flux to the Thermocouple Bead
........................................
100
Figure 7-25. Cutting Solder
............................................................................
100
Figure 7-26. Positioning Solder on IHS
.............................................................
101
Figure 7-27. Solder Station Setup
...................................................................
102
Figure 7-28. View Through Lens at Solder Station
..............................................
103
Figure 7-29. Moving Solder back onto Thermocouple Bead
..................................
103
Figure 7-30. Removing Excess Solder
..............................................................
104
Figure 7-31. Thermocouple placed into groove
..................................................
105
Figure 7-32. Removing Excess Solder
..............................................................
105
Figure 7-33. Filling Groove with Adhesive
.........................................................
106
Figure 7-34. Application of Accelerant
..............................................................
106
Figure 7-35. Removing Excess Adhesive from IHS
.............................................
107
Figure 7-36. Finished Thermocouple Installation
................................................
107
Figure 7-37. Thermocouple Wire Management
...................................................
108
Figure 7-38. Thermistor Set Points
..................................................................
110
Figure 7-39. Example Fan Speed Control Implementation
...................................
111
Figure 7-40. Fan Speed Control
.......................................................................
112
Figure 7-41. Temperature Range = 5 °C
...........................................................
113
Figure 7-42. Temperature Range = 10 °C
.........................................................
114
Figure 7-43. On-Die Thermal Sensor and Thermistor
..........................................
115
Figure 7-44. FSC Definition Example
................................................................
117
Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified . 122
Figure 7-46. Thermal sensor Location Illustration
..............................................
123
Figure 7-47. ATX/μATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1
..............................
129
Figure 7-48. ATX/μATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2
..............................
130
Figure 7-49. ATX/μATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3
..............................
131
Figure 7-50. BTX Thermal Module Keep Out Volumetric – Sheet 1
........................
132
Figure 7-51. BTX Thermal Module Keep Out Volumetric – Sheet 2
........................
133
Figure 7-52. BTX Thermal Module Keep Out Volumetric – Sheet 3
........................
134
Figure 7-53. BTX Thermal Module Keep Out Volumetric – Sheet 4
........................
135
Figure 7-54. BTX Thermal Module Keep Out Volumetric – Sheet 5
........................
136
Figure 7-55. ATX Reference Clip – Sheet 1
........................................................
137
Figure 7-56. ATX Reference Clip - Sheet 2
........................................................
138
Figure 7-57. Reference Fastener - Sheet 1
........................................................
139
Figure 7-58. Reference Fastener - Sheet 2
........................................................
140
Figure 7-59. Reference Fastener - Sheet 3
........................................................
141
Figure 7-60. Reference Fastener - Sheet 4
........................................................
142
Figure 7-61. Intel
®
D60188-001 Reference Solution Assembly
.............................
143
Figure 7-62. Intel
®
D60188-001 Reference Solution Heatsink
..............................
144
Figure 7-63. Intel
®
E18764-001 Reference Solution Assembly
.............................
145