Motorola 8900 User Manual - Page 84

C24 Mounting, C24 Mounting Area

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C24 Mounting C24 Mounting The C24 incorporates 2 mechanical holes for installing the module onto the application board. The holes are 2.4 millimeters in diameter, which accommodates several types of mechanical elements. Several mechanical approaches may be applied to mount and fasten C24 to the application board. Using M2 screws with suitable washers to mount the module onto spacers, a bracket or chassis is a recommended design. Special attention must be paid to the area surrounding the C24 mounting holes. A grounding pad of 4.4 milimeters in diameter surrounds these holes. The diameter and area of this pad must not be exceeded by any mechanical or electrical element. Several electrical components, which are not shielded, are located near the holes. These components must not be in contact with the mounting elements or with other parts of the application board, and care must be taken to avoid any damage. Figure 4-6 depicts the C24 mounting area. Figure 4-6: C24 Mounting Area The holes are used for mechanical mounting of C24 to the application board but also for grounding support. Using conductive elements to install C24 significantly improves the overall grounding of the module and therefore improves the C24 performance and stability. It is required to use screws or other mechanical elements to fasten C24 to the application board, but it is highly recommended to use conductive elements to improve the module's performance. 60 C24 Module Hardware Description December 15, 2008

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C24 Mounting
60
C24 Module Hardware Description
December 15, 2008
C24 Mounting
The C24 incorporates 2 mechanical holes for installing the module onto the application board.
The holes are 2.4 millimeters in diameter, which accommodates several types of mechanical
elements.
Several mechanical approaches may be applied to mount and fasten C24 to the application board.
Using M2 screws with suitable washers to mount the module onto spacers, a bracket or chassis is
a recommended design.
Special attention must be paid to the area surrounding the C24 mounting holes. A grounding pad
of 4.4 milimeters in diameter surrounds these holes. The diameter and area of this pad must not be
exceeded by any mechanical or electrical element. Several electrical components, which are not
shielded, are located near the holes. These components must not be in contact with the mounting
elements or with other parts of the application board, and care must be taken to avoid any
damage.
Figure 4-6
depicts the C24 mounting area.
Figure 4-6: C24 Mounting Area
The holes are used for mechanical mounting of C24 to the application board but also for
grounding support. Using conductive elements to install C24 significantly improves the overall
grounding of the module and therefore improves the C24 performance and stability.
It is required to use screws or other mechanical elements to fasten C24 to the application board,
but it is highly recommended to use conductive elements to improve the module's performance.