AMD AXDA3200DKV4E Data Sheet - Page 51

Chapter 8

Electrical Data

39

26237C—May 2003

AMD Athlon™ XP Processor Model 10 Data Sheet

Preliminary Information

8.12

Thermal Diode Characteristics

The AMD Athlon XP processor model 10 provides a diode that

can be used in conjunction with an external temperature sensor

to determine the die temperature of the processor. The diode

anode (THERMDA) and cathode (THERMDC) are available as

pins on the processor, as described in “THERMDA and

THERMDC Pins” on page 77.

For information about thermal design for the AMD Athlon XP

processor model 10, including layout and airflow

considerations, see the

AMD Processor Thermal, Mechanical, and

Chassis Cooling Design Guide

, order# 23794, and the cooling

guidelines on

http://www.amd.com

.

Thermal Diode

Electrical

Characteristics

Table 17 shows the AMD Athlon XP processor model 10

characteristics of the on-die thermal diode. For information

about calculations for the ideal diode equation and

temperature offset correction, see Appendix A, "Thermal

Diode Calculations," on page 77.

Thermal Protection

Characterization

The following section describes parameters relating to thermal

protection. The implementation of thermal control circuitry to

control processor temperature is left to the manufacturer to

determine how to implement.

Table 17.

Thermal Diode Electrical Characteristics

Symbol

Parameter

Description

Min

Nom

Max

Units

Notes

I

Sourcing current

5

300

μA

1

n

f, lumped

Lumped ideality

factor

1.00000

1.00374

1.00900

2, 3, 4

n

f, actual

Actual ideality factor

1.00261

3, 4

R

T

Series Resistance

0.93

Ω

3, 4

Notes:

1.

The sourcing current should always be used in forward bias only.

2.

Characterized at 95°C with a forward bias current pair of 10

µ

A and 100

µ

A. AMD

recommends using a minimum of two sourcing currents to accurately measure the

temperature of the thermal diode.

3.

Not 100% tested. Specified by design and limited characterization.

4.

The lumped ideality factor adds the effect of the series resistance term to the actual ideality

factor.

The series resistance term indicates the resistance from the pins of the processor to the

on-die thermal diode.

The value of the lumped ideality factor depends on the sourcing current

pair used.

Section	Page
Table of Contents	3
List of Figures	7
List of Tables	9
Revision History	11
1 Overview	13
1.1 QuantiSpeed™ Architecture Summary	14
2 Interface Signals	17
2.1 Overview	17
2.2 Signaling Technology	17
2.3 Push-Pull (PP) Drivers	18
2.4 AMDAthlon™ System Bus Signals	18
3 Logic Symbol Diagram	19
4 Power Management	21
4.1 Power Management States	21
Working State	22
Halt State	22
Stop Grant States	22
Probe State	24
4.2 Connect and Disconnect Protocol	24
Connect Protocol	24
Connect State Diagram	28
4.3 Clock Control	30
5 CPUID Support	31
6 Advanced 333 Front-Side Bus AMDAthlon™ XP Processor Model 10 Specifications	33
6.1 Electrical and Thermal Specifications for the Advanced 333 FSB AMDAthlon™ XP Processor Model 10	33
6.2 Advanced 333 FSB AMDAthlon™ XP Processor Model 10 SYSCLK and SYSCLK# AC Characteristics	34
6.3 Advanced 333 FSB AMDAthlon™ System Bus AC Characteristics	35
6.4 Advanced 333 FSB AMDAthlon™ System Bus DC Characteristics	36
7 Advanced 400 Front-Side Bus AMDAthlon™ XP Processor Model 10 Specifications	37
7.1 Electrical and Thermal Specifications for the Advanced 400 FSB AMDAthlon™ XP Processor Model 10	37
7.2 Advanced 400 FSB AMDAthlon™ XP Processor Model 10 SYSCLK and SYSCLK# AC Characteristics	38
7.3 Advanced 400 FSB AMDAthlon™ System Bus AC Characteristics	39
7.4 Advanced 400 FSB AMDAthlon™ System Bus DC Characteristics	40
8 Electrical Data	41
8.1 Conventions	41
8.2 Interface Signal Groupings	41
8.3 Voltage Identification (VID[4:0])	42
8.4 Frequency Identification (FID[3:0])	43
8.5 VCCA AC and DC Characteristics	43
8.6 Decoupling	43
8.7 VCC_CORE Characteristics	44
8.8 Absolute Ratings	46
8.9 SYSCLK and SYSCLK# DC Characteristics	47
8.10 General AC and DC Characteristics	48
8.11 Open Drain Test Circuit	50
8.12 Thermal Diode Characteristics	51
Thermal Diode Electrical Characteristics	51
Thermal Protection Characterization	51
8.13 APIC Pins AC and DC Characteristics	53
9 Signal and PowerUp Requirements	55
9.1 PowerUp Requirements	55
Signal Sequence and Timing Description	55
Clock Multiplier Selection (FID[3:0])	58
9.2 Processor Warm Reset Requirements	58
Northbridge Reset Pins	58
10 Mechanical Data	59
10.1 Die Loading	59
10.2 AMDAthlon™ XP Processor Model 10 Part Number 27488 OPGA Package Dimensions	60
10.3 AMDAthlon™ XP Processor Model 10 Part Number 27493 OPGA Package Dimensions	62
11 Pin Descriptions	65
11.1 Pin Diagram and Pin Name Abbreviations	65
11.2 Pin List	75
11.3 Detailed Pin Descriptions	84
A20M# Pin	84
AMD Pin	84
AMDAthlon™ System Bus Pins	84
Analog Pin	84
APIC Pins, PICCLK, PICD[1:0]#	84
CLKFWDRST Pin	84
CLKIN, RSTCLK (SYSCLK) Pins	85
CONNECT Pin	85
COREFB and COREFB# Pins	85
CPU_PRESENCE# Pin	85
DBRDY and DBREQ# Pins	85
FERR Pin	85
FID[3:0] Pins	86
FSB_Sense[1:0] Pins	87
FLUSH# Pin	87
IGNNE# Pin	87
INIT# Pin	87
INTR Pin	88
JTAG Pins	88
K7CLKOUT and K7CLKOUT# Pins	88
Key Pins	88
NC Pins	88
NMI Pin	88
PGA Orientation Pins	88
PLL Bypass and Test Pins	88
PWROK Pin	88
SADDIN[1:0]# and SADDOUT[1:0]# Pins	89
Scan Pins	89
SMI# Pin	89
STPCLK# Pin	89
SYSCLK and SYSCLK#	89
THERMDA and THERMDC Pins	89
VCCA Pin	89
VID[4:0] Pins	89
VREFSYS Pin	90
ZN and ZP Pins	90
12 Ordering Information	91
Standard AMDAthlon™ XP Processor Model 10 Products	91
Thermal Diode Calculations	93
Ideal Diode Equation	93
Temperature Offset Correction	94
Conventions and Abbreviations	97
Signals and Bits	97
Data Terminology	98
Abbreviations and Acronyms	99

AMD AXDA3200DKV4E Data Sheet - Page 51

Thermal Diode Characteristics, Thermal Diode Electrical Characteristics

Page 51 highlights