AMD AXDA3200DKV4E Data Sheet - Page 59

Mechanical Data, 10.1 Die Loading, Die Loading

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26237C-May 2003 Preliminary Information AMD Athlon™ XP Processor Model 10 Data Sheet 10 10.1 Mechanical Data The AMD Athlon™ XP processor model 10 connects to themotherboard through a Pin Grid Array (PGA) socket named Socket A. This processor utilizes the Organic Pin Grid Array (OPGA) package type described in this chapter. For more information, see the AMD Athlon™ Processor-Based Motherboard Design Guide, order# 24363. Die Loading The processor die on the OPGA package is exposed at the top of the package. This feature facilitates heat transfer from the die to an approved heat sink. Any heat sink design should avoid loads on corners and edges of die. The OPGA package has compliant pads that serve to bring surfaces in planar contact. Tool-assisted zero insertion force sockets should be designed so that no load is placed on the ceramic substrate of the package. Table 20 shows the mechanical loading specifications for the processor die. It is critical that the mechanical loading of the heat sink does not exceed the limits shown in Table 20. Table 20. Mechanical Loading Location Dynamic (MAX) Static (MAX) Units Note Die Surface 100 30 lbf 1 Die Edge 10 10 lbf 2 Notes: 1. Load specified for coplanar contact to die surface. 2. Load defined for a surface at no more than a two-degree angle of inclination to die surface. Chapter 10 Mechanical Data 47

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Chapter 10
Mechanical Data
47
26237C—May 2003
AMD Athlon™ XP Processor Model 10 Data Sheet
Preliminary Information
10
Mechanical Data
The AMD Athlon™ XP processor model 10 connects to
themotherboard through a Pin Grid Array (PGA) socket named
Socket A. This processor utilizes the Organic Pin Grid Array
(OPGA) package type described in this chapter. For more
information, see the
AMD Athlon™ Processor-Based Motherboard
Design Guide
, order# 24363.
10.1
Die Loading
The processor die on the OPGA package is exposed at the top of
the package. This feature facilitates heat transfer from the die
to an approved heat sink. Any heat sink design should avoid
loads on corners and edges of die. The OPGA package has
compliant pads that serve to bring surfaces in planar contact.
Tool-assisted zero insertion force sockets should be designed so
that no load is placed on the ceramic substrate of the package.
Table 20 shows the mechanical loading specifications for the
processor die. It is critical that the mechanical loading of the
heat sink does not exceed the limits shown in Table 20.
Table 20.
Mechanical Loading
Location
Dynamic (MAX)
Static (MAX)
Units
Note
Die Surface
100
30
lbf
1
Die Edge
10
10
lbf
2
Notes:
1.
Load specified for coplanar contact to die surface.
2.
Load defined for a surface at no more than a two-degree angle of inclination to die surface.